Add CPG reset properties to DU node of E3 (r8a77990) SoC.
According to Laurent Pinchart, R-Car Gen3 reset is handled at the group
level so specifying one reset entry per group is sufficient.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Remove "label" properties from the LEDs device tree nodes, since
we don't have nice labels on the PCB.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add HDMI support to the HiHope RZ/G2[MN] mother board common
dtsi.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the HDMI encoder to the R8A774A1 DT in disabled state.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor. Create passive trip
points and bind them to CPUFreq cooling device that supports power
extension.
Based on work by Dien Pham <dien.pham.ry@renesas.com> for r8a7796 SoC.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Set the capacity-dmips-mhz for RZ/G2M(r8a774a1) SoC, that is based on
dhrystone.
Based on work done by Gaku Inami <gaku.inami.xw@bp.renesas.com> for
r8a7796 SoC.
The average dhrystone result for 5 iterations is as below:
r8a774a1 SoC (CA57x2 + CA53x4)
CPU max-freq dhrystone
---------------------------------
CA57 1500 MHz 11428571 lps/s
CA53 1200 MHz 5000000 lps/s
From this, CPU capacity-dmips-mhz for CA57 and CA53 are calculated
as follows:
r8a774a1 SoC
CA57 : 1024 / (11428571 / 1500) * (11428571 / 1500) = 1024
CA53 : 1024 / (11428571 / 1500) * ( 5000000 / 1200) = 560
Since each CPUs have different max frequencies, the final CPU
capacities of A53 scaled by the above difference is as below
$ cat /sys/devices/system/cpu/cpu*/cpu_capacity
1024
1024
448
448
448
448
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the "cpu-map" into r8a774a1 composed of multi-cluster. This
definition is used to parse the cpu topology.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> for r8a7796 SoC.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds LEDs support to the HiHope RZ/G2[MN] Main Board
common device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables USB3.0 host/peripheral device node for the HiHope
RZ/G2M board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add USB 2.0 support to the HiHope RZ/G2M.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Similarly to what done for the r8a7796 with commit 737e05bf03
("arm64: dts: renesas: revise properties for R-Car Gen3 SoCs'
usb 2.0"), this patch lists the clock for the USB High-Speed Module
(HS-USB) with the USB2.0 Host (EHCI/OHCI) IP DT node, and it lists
the clock for the USB2.0 Host IP with the HS-USB module DT node.
Fixes: 4c2c2fb998 ("arm64: dts: renesas: r8a774a1: Add USB2.0 phy and host(EHCI/OHCI) device nodes")
Fixes: ed898d4fc1 ("arm64: dts: renesas: r8a774a1: Add USB-DMAC and HSUSB device nodes")
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds TMU[01234] device tree nodes to the r8a774a1
SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the CMT[0123] device tree nodes to the
r8a774a1 SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds uSD and eMMC support to the HiHope RZ/G2M
board.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the R8A77990 SoC uses DU{0,1}, the range from the base address to
the 0x4000 address is used.
This patch fixed it.
Fixes: 13ee2bfc54 ("arm64: dts: renesas: r8a77990: Add display output support")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables TI HD3SS3220 device and support usb role switch
for the CAT 874 platform.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables USB3.0 host/peripheral device node for the cat874
board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the new renesas,companion property to the LVDS0 node to point to the
companion LVDS encoder LVDS1.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Tested-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Enable RWDT and use 60 seconds as default timeout.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables PCIEC[01] PCI express controller on the sub board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Declare pcie bus clock, since it is generated on the HiHope RZ/G2M main
board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds pincontrol support to scif2/scif clock.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the HiHope RZ/G2M main board:
- Memory,
- Main crystal,
- Serial console
This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.
The operating points for the cluster with the A57s are:
Frequency | Voltage
-----------|---------
500 MHz | 0.82V
1.0 GHz | 0.82V
1.5 GHz | 0.82V
The operating points for the cluster with the A53s are:
Frequency | Voltage
-----------|---------
800 MHz | 0.82V
1.0 GHz | 0.82V
1.2 GHz | 0.82V
This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A5 cooling device supports 5 cooling states which can be categorised as
follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.
As per 87c059e9c3 ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:
Steps to reproduce:
- start AVB TX stream (Using aplay via MSE),
- disconnect+reconnect the eth cable,
- after a reconnection the eth connection goes iteratively up/down
without user interaction,
- this may heal after some seconds or even stay for minutes.
As the documentation specifies, the "renesas,no-ether-link" option
should be used when a board does not provide a proper AVB_LINK signal.
There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
and ULCB starter kits since the AVB_LINK is correctly handled by HW.
Choosing to keep or remove the "renesas,no-ether-link" option will have
impact on the code flow in the following ways:
- keeping this option enabled may lead to unexpected behavior since the
RX & TX are enabled/disabled directly from adjust_link function
without any HW interrogation,
- removing this option, the RX & TX will only be enabled/disabled after
HW interrogation. The HW check is made through the LMON pin in PSR
register which specifies AVB_LINK signal value (0 - at low level;
1 - at high level).
In conclusion, the present change is also a safety improvement because
it removes the "renesas,no-ether-link" option leading to a proper way
of detecting the link state based on HW interrogation and not on
software heuristic.
Fixes: 8441ef643d ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Apparently this DTS crossed over with commit 31af04cd60 ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Convert bootargs from ip=dhcp to ip=on
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables BT support for the CAT874 board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables WLAN support for the CAT874 board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a7795 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a77965 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a7796 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds description of TI WL1837 and links interfaces
to communicate with the IC, namely the SDIO interface to WLAN.
Signed-off-by: Spyridon Papageorgiou <spapageorgiou@de.adit-jv.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The ports node of vin4 only has one sub-node and thus does
not need #address-cells/#size-cells and the sub-node does
not need an exit.
This addresses the following warning:
# make dtbs W=1
...
arch/arm64/boot/dts/renesas/r8a77995-draak.dts:492.8-503.4: Warning (graph_child_address): /soc/video@e6ef4000/ports: graph node has single child node 'port@0', #address-cells/#size-cells are not necessary
Fixes: 6a0942c20f ("arm64: dts: renesas: draak: Describe CVBS input")
Cc: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
The CAT874 board pushes sound via I2S over SSI0 into the
TDA19988BET chip.
This commit wires things up so that we can get sound out of
the HDMI interface.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The CAT874 board comes with a HDMI connector, managed by
a TDA19988BET chip, connected to the RZ/G2E SoC via DPAD.
This patch adds the necessary support to the board DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add IPMMU-DS0 to the Ethernet-AVB device node.
Based on work by Magnus Damm for the r8a7795.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up r8a774a1 Audio-DMAC nodes to the IPMMU-MP.
Based on work for the r8a7795 by Magnus Damm.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up r8a774a1 DMAC nodes to the IPMMUs. In particular SYS-DMAC0
gets tied to IPMMU-DS0, and SYS-DMAC1 and SYS-DMAC2 get tied to IPMMU-DS1.
Based on work for the r8a7796 by Magnus Damm.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The r8a774a1 has a single FDP1 instance similar to r8a7796.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the DU device to r8a774a1.dtsi in a disabled state.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The r8a774a1 soc has 5 VSP instances similar to r8a7796.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Remove the "reg-names" property from the display node of R-Car Gen3 R8A77965
device tree.
No other mainline R-Car Gen3 SoC has that property specified.
Fixes: 2f2c71bfc8 ("arm64: dts: renesas: r8a77965: Populate the DU instance placeholder")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[reworded commit message, sent upstream]
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CMT{0|1|2|3} device nodes for r8a77990 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CMT{0|1|2|3} device nodes for r8a77965 SoC.
Tested-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CMT{0|1|2|3} device nodes for r8a7795 SoC.
Tested-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds USB 2.0 HOST support to the CAT874 board.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The Salvator-X and XS boards have a 4 lines DIP switch and 3 push
buttons connected to SoC GPIOs, meant to be used as general-purpose test
keys. Add a corresponding node in DT, mapping (semi-randomly) the DIP
switch to keys 1-4 and the push buttons to keys A-C.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic audio dmac register only supports busif from 0 to 3,
in order to use busif4 ~ busif7, extended audio dmac register
need to be used.
This patch updates H3 (= r8a7795), M3-W (= r8a7796) and
M3-N (=r8a77965) to use extended audio dmac register set.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the R-Car Gen3 Hardware Manual Errata for Rev 1.00 of
August 24, 2018, the TX clock internal Delay mode does'nt support
on R-Car D3. This patch fixes EthernetAVB phy mode to rgmii.
This is achieved by simply dropping the phy-mode property from
r8a77995-draak.dts as the default property for this for r8a77995,
as set in r8a77995.dtsi, is "rgmii".
Signed-off-by: Kazuya Mizuguchi <kazuya.mizuguchi.ks@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Ulrich Hecht <uli+renesas@fpond.eu>
This patch sorts the node label to improve maintainability.
The sort has been done alphabetically with the node label name as the
key.
This patch does not include functional changes.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Update Ebisu and Draak bootargs to match other boards
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the latest information, clkp2 is available on RZ/G2.
Modify CAN0 and CAN1 nodes accordingly.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The CANFD implementation on the RZ/G2E (a.k.a. r8a774c0) is
identical to the one found on the r8a77990.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the latest information, clkp2 is available on RZ/G2.
Modify CAN0 and CAN1 nodes accordingly.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
On Ebisu the DDR0 power rail needs to be kept powered when backup mode is
enabled. Reflect this in the "rohm,ddr-backup-power" property for the
BD9571MWV PMIC node.
The accessory power switch (SW23) is a toggle switch, hence specify
"rohm,rstbmode-level".
Based on advice from Geert Uytterhoeven.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
The compatible value renesas,rcar-gen3-csi2 was used while prototyping
the R-Car CSI-2 driver but was removed before the driver was merged.
Remove the only occurrence of the compatible value which manage to make
it upstream.
Fixes: ec70407ae7 ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The compatible value renesas,rcar-gen3-csi2 was used while prototyping
the R-Car CSI-2 driver but was removed before the driver was merged.
Fixes: e961ab42e0 ("arm64: dts: renesas: r8a774c0: Add VIN and CSI-2 device nodes")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Enable both CAN0 and CAN1 controllers on R8A77995 Draak board,
since they are available on connectors CN43, CN44 respectively.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Enable RWDT and use 60 seconds as default timeout.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <chris.paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Both VIN4 and VIN5 are connected to CSI40 and can be configured at
runtime to use the single video source connected to CSI40. Enable VIN5
to allow it to be used in this fashion.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[Niklas: rewrite commit message]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds LEDs support to the CAT874 board specific
device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds Epson RX-8571 real time clock support.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add CAN support to the CAT875 sub board.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
We usually leave a space between "=" and the value of device
tree properties, but unfortunately that was overlooked for the
"clocks" property of cpu@0 and cpu@1.
This patch fixes the spacing with the "clocks" property of
cpu@0 and cpu@1.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
Applies commit 8d14bfa074 ("arm64: dts: renesas: r8a7796: add SSIU
support for sound") and commit 10bd03fa89 ("arm64: dts: renesas:
r8a7796: remove BUSIF0 settings from rcar_sound,ssi") for r8a77965.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Timo Wischer <twischer@de.adit-jv.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The register address used for the reg property of the adv7482 node in
other Renesas device trees are decimal not hex, change this for Ebisu to
align it with the others.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[Niklas: rewrite commit message]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The LVDS1 encoder must supply a pixel clock to the DU for the DPAD
output when the LVDS0 encoder is used. Enable it despite its output not
being connected.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The LVDS1 encoder must supply a pixel clock to the DU for the DPAD
output when the LVDS0 encoder is used. Enable it despite its output not
being connected.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
commit 78bc93b3ff ("arm64: dts: renesas: r8a7796: Add address
properties to rcar_sound port nodes") added missing #address-cells
and #size-cells for sound ports.
But, these are based on platform, not on SoC. This patch cleanups it.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Timo Wischer <twischer@de.adit-jv.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the ON Semiconductor PCA9654 I/O expander on the first I2C
bus, which provides 8 extra GPIOs.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This is a smaller update than the past few times, but with just over
500 non-merge changesets still dwarfes the rest of the SoC tree.
Three new SoC platforms get added, each one a follow-up to an existing
product, and added here in combination with a reference platform:
- Renesas RZ/A2M (R7S9210) 32-bit Cortex-A9 Real-time imaging processor
https://www.renesas.com/eu/en/products/microcontrollers-microprocessors/rz/rza/rza2m.html
- Renesas RZ/G2E (r8a774c0) 64-bit Cortex-A53 SoC "for
Rich Graphics Applications".
https://www.renesas.com/eu/en/products/microcontrollers-microprocessors/rz/rzg/rzg2e.html
- NXP i.MX8QuadXPlus 64-bit Cortex-A35 SoC
https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/i.mx-applications-processors/i.mx-8-processors/i.mx-8x-family-arm-cortex-a35-3d-graphics-4k-video-dsp-error-correcting-code-on-ddr:i.MX8X
These are actual commercial products we now support with an in-kernel
device tree source file:
- Bosch Guardian is a product made by Bosch Power
Tools GmbH, based on the Texas Instruments AM335x chip
- Winterland IceBoard is a Texas Instruments AM3874 based
machine used in telescopes at the south pole and elsewhere, see commit
d031773169 for some pointers:
- Inspur on5263m5 is an x86 server platform with an Aspeed
ast2500 baseboard management controller. This is for running on
the BMC.
- Zodiac Digital Tapping Unit, apparently a kind of ethernet
switch used in airplanes.
- Phicomm K3 is a WiFi router based on Broadcom bcm47094
- Methode Electronics uDPU FTTdp distribution point unit
- X96 Max, a generic TV box based on Amlogic G12a (S905X2)
- NVIDIA Shield TV (Darcy) based on Tegra210
And then there are several new SBC, evaluation, development or modular
systems that we add:
- Three new Rockchips rk3399 based boards:
- FriendlyElec NanoPC-T4 and NanoPi M4
- Radxa ROCK Pi 4
- Five new i.MX6 family SoM modules and boards for industrial
products:
- Logic PD i.MX6QD SoM and evaluation baseboad
- Y Soft IOTA Draco/Hydra/Ursa family boards based on i.MX6DL
- Phytec phyCORE i.MX6 UltraLite SoM and evaluation module
- MYIR Tech MYD-LPC4357 development based on the NXP lpc4357
microcontroller
- Chameleon96, an Intel/Altera Cyclone5 based FPGA development
system in 96boards form factor
- Arm Fixed Virtual Platforms(FVP) Base RevC, a purely
virtual platform for corresponding to the latest "fast model"
- Another Raspberry Pi variant: Model 3 A+, supported both
in 32-bit and 64-bit mode.
- Oxalis Evalkit V100 based on NXP Layerscape LS1012a,
in 96Boards enterprise form factor
- Elgin RV1108 R1 development board based on 32-bit Rockchips RV1108
For already supported boards and SoCs, we often add support for new
devices after merging the drivers. This time, the largest changes include
updates for
- STMicroelectronics stm32mp1, which was now formally
launched last week
- Qualcomm Snapdragon 845, a high-end phone and low-end laptop chip
- Action Semi S700
- TI AM654x, their recently merged 64-bit SoC from the OMAP family
- Various Amlogic Meson SoCs
- Mediatek MT2712
- NVIDIA Tegra186 and Tegra210
- The ancient NXP lpc32xx family
- Samsung s5pv210, used in some older mobile phones
Many other chips see smaller updates and bugfixes beyond that.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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Merge tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC device tree updates from Arnd Bergmann:
"This is a smaller update than the past few times, but with just over
500 non-merge changesets still dwarfes the rest of the SoC tree.
Three new SoC platforms get added, each one a follow-up to an existing
product, and added here in combination with a reference platform:
- Renesas RZ/A2M (R7S9210) 32-bit Cortex-A9 Real-time imaging
processor:
https://www.renesas.com/eu/en/products/microcontrollers-microprocessors/rz/rza/rza2m.html
- Renesas RZ/G2E (r8a774c0) 64-bit Cortex-A53 SoC "for Rich Graphics
Applications":
https://www.renesas.com/eu/en/products/microcontrollers-microprocessors/rz/rzg/rzg2e.html
- NXP i.MX8QuadXPlus 64-bit Cortex-A35 SoC:
https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/i.mx-applications-processors/i.mx-8-processors/i.mx-8x-family-arm-cortex-a35-3d-graphics-4k-video-dsp-error-correcting-code-on-ddr:i.MX8X
These are actual commercial products we now support with an in-kernel
device tree source file:
- Bosch Guardian is a product made by Bosch Power Tools GmbH, based
on the Texas Instruments AM335x chip
- Winterland IceBoard is a Texas Instruments AM3874 based machine
used in telescopes at the south pole and elsewhere, see commit
d031773169 for some pointers:
- Inspur on5263m5 is an x86 server platform with an Aspeed ast2500
baseboard management controller. This is for running on the BMC.
- Zodiac Digital Tapping Unit, apparently a kind of ethernet switch
used in airplanes.
- Phicomm K3 is a WiFi router based on Broadcom bcm47094
- Methode Electronics uDPU FTTdp distribution point unit
- X96 Max, a generic TV box based on Amlogic G12a (S905X2)
- NVIDIA Shield TV (Darcy) based on Tegra210
And then there are several new SBC, evaluation, development or modular
systems that we add:
- Three new Rockchips rk3399 based boards:
- FriendlyElec NanoPC-T4 and NanoPi M4
- Radxa ROCK Pi 4
- Five new i.MX6 family SoM modules and boards for industrial
products:
- Logic PD i.MX6QD SoM and evaluation baseboad
- Y Soft IOTA Draco/Hydra/Ursa family boards based on i.MX6DL
- Phytec phyCORE i.MX6 UltraLite SoM and evaluation module
- MYIR Tech MYD-LPC4357 development based on the NXP lpc4357
microcontroller
- Chameleon96, an Intel/Altera Cyclone5 based FPGA development system
in 96boards form factor
- Arm Fixed Virtual Platforms(FVP) Base RevC, a purely virtual
platform for corresponding to the latest "fast model"
- Another Raspberry Pi variant: Model 3 A+, supported both in 32-bit
and 64-bit mode.
- Oxalis Evalkit V100 based on NXP Layerscape LS1012a, in 96Boards
enterprise form factor
- Elgin RV1108 R1 development board based on 32-bit Rockchips RV1108
For already supported boards and SoCs, we often add support for new
devices after merging the drivers. This time, the largest changes
include updates for
- STMicroelectronics stm32mp1, which was now formally launched last
week
- Qualcomm Snapdragon 845, a high-end phone and low-end laptop chip
- Action Semi S700
- TI AM654x, their recently merged 64-bit SoC from the OMAP family
- Various Amlogic Meson SoCs
- Mediatek MT2712
- NVIDIA Tegra186 and Tegra210
- The ancient NXP lpc32xx family
- Samsung s5pv210, used in some older mobile phones
Many other chips see smaller updates and bugfixes beyond that"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (506 commits)
ARM: dts: exynos: Fix max voltage for buck8 regulator on Odroid XU3/XU4
dt-bindings: net: ti: deprecate cpsw-phy-sel bindings
ARM: dts: am335x: switch to use phy-gmii-sel
ARM: dts: am4372: switch to use phy-gmii-sel
ARM: dts: dm814x: switch to use phy-gmii-sel
ARM: dts: dra7: switch to use phy-gmii-sel
arch: arm: dts: kirkwood-rd88f6281: Remove disabled marvell,dsa reference
ARM: dts: exynos: Add support for secondary DAI to Odroid XU4
ARM: dts: exynos: Add support for secondary DAI to Odroid XU3
ARM: dts: exynos: Disable ARM PMU on Odroid XU3-lite
ARM: dts: exynos: Add stdout path property to Arndale board
ARM: dts: exynos: Add minimal clkout parameters to Exynos3250 PMU
ARM: dts: exynos: Enable ADC on Odroid HC1
arm64: dts: sprd: Remove wildcard compatible string
arm64: dts: sprd: Add SC27XX fuel gauge device
arm64: dts: sprd: Add SC2731 charger device
arm64: dts: sprd: Add ADC calibration support
arm64: dts: sprd: Remove PMIC INTC irq trigger type
arm64: dts: rockchip: Enable tsadc device on rock960
ARM: dts: rockchip: add chosen node on veyron devices
...
Correct the DMA channels for SCIF5 from 16..47 to 0..15, as was done for
R-Car E3.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Fixes: 2660a6af69 ("arm64: dts: renesas: r8a774c0: Add SCIF and HSCIF nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the R-Car Gen3 Hardware Manual Errata for Rev 1.50 of Feb
12, 2019, the DMA channels for SCIF5 are corrected from 16..47 to 0..15
on R-Car E3.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Fixes: a5ebe5e49a ("arm64: dts: renesas: r8a77990: Add SCIF-{0,1,3,4,5} device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables PCIEC0 PCI express controller on the sub board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Silicon Linux CAT 874 board has 2GB DDR memory. Update the dma-ranges
mapping for pciec0 node. Also declare pcie bus clock, since it is
generated on the CAT874 main board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch defines OOP tables for all CPUs, similarly to
what done by Takeshi Kihara and Yoshihiro Kaneko for the
R8A77990.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch define OOP tables for all CPUs.
This allows CPUFreq to function.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Successfully tested on H3 ES2.0 and M3-N ES1.0.
Transfer rates where >160MB/s for H3 and >200MB/s for M3-N.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The 'arm,armv8' compatible string is only for software models. It adds
little value otherwise and is inconsistently used as a fallback on some
platforms. Remove it from those platforms.
This fixes warnings generated by the DT schema.
Reported-by: Michal Simek <michal.simek@xilinx.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Will Deacon <will.deacon@arm.com>
Acked-by: Antoine Tenart <antoine.tenart@bootlin.com>
Acked-by: Nishanth Menon <nm@ti.com>
Acked-by: Maxime Ripard <maxime.ripard@bootlin.com>
Acked-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: Chanho Min <chanho.min@lge.com>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Masahiro Yamada <yamada.masahiro@socionext.com>
Acked-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Acked-by: Tero Kristo <t-kristo@ti.com>
Acked-by: Wei Xu <xuwei5@hisilicon.com>
Acked-by: Liviu Dudau <liviu.dudau@arm.com>
Acked-by: Matthias Brugger <matthias.bgg@gmail.com>
Acked-by: Michal Simek <michal.simek@xilinx.com>
Acked-by: Scott Branden <scott.branden@broadcom.com>
Acked-by: Kevin Hilman <khilman@baylibre.com>
Acked-by: Chunyan Zhang <zhang.lyra@gmail.com>
Acked-by: Robert Richter <rrichter@cavium.com>
Acked-by: Jisheng Zhang <Jisheng.Zhang@synaptics.com>
Acked-by: Dinh Nguyen <dinguyen@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
This patch adds ethernet support to the sub board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds pincontrol support to scif2.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The EK874 development kit from Silicon Linux is made of CAT874 (the main
board) and CAT875 (the sub board that goes on top of CAT874).
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the Si-Linux board based on RZ/G2E:
- Memory,
- Main crystal,
- Serial console
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Enable HS400 of SDHI3 using the corresponding DT property.
No further changes are required.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
SCIF2 on R-Car E3 can be used with both DMAC1 and DMAC2.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
SCIF2 on RZ/G2E can be used with both DMAC1 and DMAC2.
Fixes: 1b24f9e8ea3ff95f ("arm64: dts: renesas: r8a774c0: Add SCIF and HSCIF nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
There are two regulator1 nodes in the Ebisu DTS right now, one 3.3V for
the eMMC and one 12V for the backlight. This causes one to be overwritten
by the other, ultimatelly resulting in inoperable eMMC, which depends on
the former. Fix this by renumbering the backlight regulator to regulator2.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reported-by: Simon Horman <horms+renesas@verge.net.au>
Fixes: 9d16c4a10e ("arm64: dts: renesas: r8a77990: ebisu: Add backlight")
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Specify EtherAVB PHY IRQ in the V3M Starter Kit board's device tree, now
that we have the GPIO support (previously phylib had to resort to polling).
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Current Ebisu board is using simple-scu-audio-card
which is used for Sampling Rate Convert, or MIXer, etc.
But, Ebisu is not using such feature.
Then, simple-audio-card is very enough.
This patch fixup it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Before, BUSIF which is needed for DMA transfer was automatically handled
via SSI, but it cared BUSIF0 only.
Now, rsnd driver can handle BUSIF0-7 (= for Gen3) BUSIF0-3 (= for Gen2)
via SSIU, and it is keeping compatibility.
Thus, BUSIF0 settings via SSI had been kept to avoid git merge timing
issue / git bisect issue, but it is no longer needed.
This patch removes it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Before, BUSIF which is needed for DMA transfer was automatically handled
via SSI, but it cared BUSIF0 only.
Now, rsnd driver can handle BUSIF0-7 (= for Gen3) BUSIF0-3 (= for Gen2)
via SSIU, and it is keeping compatibility.
Thus, BUSIF0 settings via SSI had been kept to avoid git merge timing
issue / git bisect issue, but it is no longer needed.
This patch removes it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
KingFisher has pcm3168 sound codec. This patch enables it.
Because pcm3168 can't handle symmetric channel on playback/
capture, we need to handle it as different DAI.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds missing ULCB HDMI sound support.
To use sound card, HDMI video is mandatory.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
ULCB can use daughter board which is called as KingFisher.
It has extra sound interface, thus we want to use it.
But, basically, ALSA SoC can't use Multiple sound card with single
CPU sound interface (= SSI). Thus we need to use Single Sound Card
with multiple DAI interface.
To be easy to expand ULCB sound card on KingFisher, it is better to
use multi-dai-link style sound card on ULCB sound DT.
Now, "simple-audio-card" / "audio-graph-card" both can support
multi-dai-link style, but HDMI sound support (which is not yet supported
on ULCB) needs "audio-graph-card".
Using audio-graph-card is better selection.
This patch exchange current sound card to use it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
As of commit 6d2ca85279 ("dt-bindings: display: renesas: Deprecate
LVDS support in the DU bindings"), the internal LVDS encoder has DT
bindings separate from the DU. The device trees for all R-Car H3 and
M3-W development boards were ported over to the new model, but
Salvator-XS boards equipped with an R-Car M3-W SoC were forgotten.
Fixes: 58e8ed2ee9 ("arm64: dts: renesas: Convert to new LVDS DT bindings")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the i2c nodes so that sub-nodes of the soc node are sorted by bus
address.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the pciec0 node so that sub-nodes of the soc node are
sorted by bus address.
This change has no run-time affect.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Add device nodes for VIN4, VIN5 and CSI40 to RZ/G2E (a.k.a. R8A774C0)
SoC specific device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds PCI express channel 0 device tree node to the
RZ/G2E (a.k.a. R8A774C0) SoC dtsi.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the RZ/G2E Audio-DMAC device to IPMMU-MP as stated by the
RZ/G2 User's manual.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the RZ/G2E AVB device to IPMMU-DS0 as stated by the
RZ/G2 User's manual.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up SYS-DMAC0, SYS-DMAC1, and SYS-DMAC2 to IPMMU-DS0 and
IPMMU-DS1, according to what reported by the RZ/G2 User's manual.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add usb3.0 host and function device nodes to the RZ/G2E SoC dtsi.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2E (a.k.a. R8A774C0) has one RGB output and two LVDS
outputs connected to DU.
This patch add support for DU, LVDS encoders, VSP and FCP.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add PWM support to the RZ/G2E (a.k.a. R8A774C0) SoC specific
device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add sound support for the RZ/G2E SoC (a.k.a. R8A774C0).
This work is based on similar work done on the R8A77990 SoC
by Yoshihiro Kaneko <ykaneko0929@gmail.com>.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for all MSIOF SPI controllers on RZ/G2E SoC.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the thermal device node and the thermal-zones
node to the SoC specific dtsi for the RZ/G2E.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for both RZ/G2E CAN channels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the I2C[0-7] and IIC Bus Interface for DVFS (IIC for DVFS)
devices nodes to the r8a774c0 device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add SDHI nodes to the DT of the r8a774c0 SoC.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add a device node for the second Cortex-A53 CPU core on the Renesas
RZ/G2E (a.k.a r8a774c0) SoC, and adjust the interrupt delivery masks
for the ARM Generic Interrupt Controller and Architectured Timer.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add watchdog support to the RZ/G2E (a.k.a. R8A774C0) SoC
specific device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the SoC specific part of the Ethernet AVB
device tree node.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add GPIO device nodes to the DT of the r8a774c0 SoC.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add PFC support to the RZ/G2E (a.k.a. r8a774c0) SoC specific
device tree.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add support for the Interrupt Controller for External Devices
(INTC-EX) on RZ/G2E.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for all RZ/G2E SCIF and HSCIF serial ports,
including clocks, power domains and DMAs.
According to the HW user manual, SCIF[015] and HSCIF[012] are
connected to both SYS-DMAC1 and SYS-DMAC2, while SCIF[34] and
HSCIF[34] are connected to SYS-DMAC0.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the RZ/G2E SoC (a.k.a. r8a774c0).
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the R-Car Gen3 Hardware Manual Errata for Rev 1.00 of
August 24, 2018, the TX clock internal delay mode doesn't support
on R-Car E3. This patch fixes EthernetAVB phy mode to rgmii.
This is achieved by simply dropping the phy-mode property from
r8a77990-ebisu.dts as the default property for this for r8a77990,
as set in r8a77990.dtsi, is "rgmii".
Signed-off-by: Kazuya Mizuguchi <kazuya.mizuguchi.ks@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Ulrich Hecht <uli+renesas@fpond.eu>
SCIF2 on R-Car M3-N can be used with both DMAC1 and DMAC2.
Fixes: 0ea5b2fd38 ("arm64: dts: renesas: r8a77965: Add SCIF device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
