Greg Kroah-Hartman c23ff2aa3e interconnect changes for 5.7 ... Here is a pull request with interconnect changes for the 5.7-rc1 merge window. It contains just driver updates, and these are: - Refactoring of the SDM845 driver, which is now improved to better represent the hardware. - New driver for SC7180 platforms. - New driver for OSM L3 interconnect hardware found on SDM845/SC7180 platforms. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> -----BEGIN PGP SIGNATURE----- iQIcBAABAgAGBQJedJ1QAAoJEIDQzArG2BZjHboP/2bxPoImL9MBsPY31qn4G8Uf RPHz5pgO0LMygFY+oskbY68H61qQclLkXG/KZ35OnK2vveWZDI3jF2Wims3P7Wjt bErrVzSL9wJGYR8efIamPsTK8OGFePGJgf/dKic63yXTPM/x1E+RGavUOXkW0hyo XNNfAJiC1Q3l+yAc8ZIEQ+Ys+KR93BYRi9IeAmp5/9CvC2UN3ZrlrC6989WZiBSY hHQXdOhcP/n258Nd1nlB2/0zdIar3PbdW0I3mlK7Fhfb04RwiSihQzs6vPJ2mc62 aoMGdtrAVxd9sTPGAw++2eOsLx01aqTVK7N+aHGygD4buoz53XtOUe5j/wB/Pv5+ fMtN3ddCoNAEwxD5hgR7iaAOGsEByl4JFdWOKMIXByiAAUoegIiAVx8Gv1qvT6Ma NZBuBYbgEW0AHLdSqZ1NDVOD6to0+81RICk3433TdHSbG8RMRRhBB66nW2c+c2qs 9pD9SX78ax4AtNSTHbXB3D5NJO5ZkXX1keFErEHKY3psdumTa2mvDZYEcS31gJ7P E0WEZNac9QvvJtoBBhwhGBCHlYnIMK6C/rMrz+GFnoMwnJWgGjHYFSISoC+8RCVr SrHPED+G678JTruYdFOSxHCM3Gv80iSTLdCYPe3VxPLFqyqPO9Lmscl3woZfeoUI KOXOoLB0wOLocNLiUzNX =jHM0 -----END PGP SIGNATURE----- Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into char-misc-next Georgi writes: interconnect changes for 5.7 Here is a pull request with interconnect changes for the 5.7-rc1 merge window. It contains just driver updates, and these are: - Refactoring of the SDM845 driver, which is now improved to better represent the hardware. - New driver for SC7180 platforms. - New driver for OSM L3 interconnect hardware found on SDM845/SC7180 platforms. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> * tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux: interconnect: qcom: Add OSM L3 support on SC7180 dt-bindings: interconnect: Add OSM L3 DT binding on SC7180 interconnect: qcom: Add OSM L3 interconnect provider support dt-bindings: interconnect: Add OSM L3 DT bindings interconnect: qcom: Allow icc node to be used across icc providers interconnect: qcom: Add SC7180 interconnect provider driver dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings interconnect: qcom: sdm845: Split qnodes into their respective NoCs interconnect: qcom: Consolidate interconnect RPMh support dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings dt-bindings: interconnect: Add YAML schemas for QCOM bcm-voter dt-bindings: interconnect: Convert qcom,sdm845 to DT schema		2020-03-20 13:45:25 +01:00
..
bindings	interconnect changes for 5.7	2020-03-20 13:45:25 +01:00
booting-without-of.txt
changesets.txt
dynamic-resolution-notes.txt
of_unittest.txt
overlay-notes.txt
usage-model.txt
writing-schema.rst	dt-bindings: Be explicit about installing deps	2020-01-23 14:34:16 -06:00