Here is a pull request with interconnect changes for the 5.7-rc1 merge
window. It contains just driver updates, and these are:
- Refactoring of the SDM845 driver, which is now improved to better
represent the hardware.
- New driver for SC7180 platforms.
- New driver for OSM L3 interconnect hardware found on SDM845/SC7180
platforms.
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into char-misc-next
Georgi writes:
interconnect changes for 5.7
Here is a pull request with interconnect changes for the 5.7-rc1 merge
window. It contains just driver updates, and these are:
- Refactoring of the SDM845 driver, which is now improved to better
represent the hardware.
- New driver for SC7180 platforms.
- New driver for OSM L3 interconnect hardware found on SDM845/SC7180
platforms.
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
* tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux:
interconnect: qcom: Add OSM L3 support on SC7180
dt-bindings: interconnect: Add OSM L3 DT binding on SC7180
interconnect: qcom: Add OSM L3 interconnect provider support
dt-bindings: interconnect: Add OSM L3 DT bindings
interconnect: qcom: Allow icc node to be used across icc providers
interconnect: qcom: Add SC7180 interconnect provider driver
dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings
interconnect: qcom: sdm845: Split qnodes into their respective NoCs
interconnect: qcom: Consolidate interconnect RPMh support
dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings
dt-bindings: interconnect: Add YAML schemas for QCOM bcm-voter
dt-bindings: interconnect: Convert qcom,sdm845 to DT schema
c23ff2aa3e
