This patch enables USB3.0 host/peripheral device node for the HiHope
RZ/G2M board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add USB 2.0 support to the HiHope RZ/G2M.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Similarly to what done for the r8a7796 with commit 737e05bf03
("arm64: dts: renesas: revise properties for R-Car Gen3 SoCs'
usb 2.0"), this patch lists the clock for the USB High-Speed Module
(HS-USB) with the USB2.0 Host (EHCI/OHCI) IP DT node, and it lists
the clock for the USB2.0 Host IP with the HS-USB module DT node.
Fixes: 4c2c2fb998 ("arm64: dts: renesas: r8a774a1: Add USB2.0 phy and host(EHCI/OHCI) device nodes")
Fixes: ed898d4fc1 ("arm64: dts: renesas: r8a774a1: Add USB-DMAC and HSUSB device nodes")
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds TMU[01234] device tree nodes to the r8a774a1
SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the CMT[0123] device tree nodes to the
r8a774a1 SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds uSD and eMMC support to the HiHope RZ/G2M
board.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the R8A77990 SoC uses DU{0,1}, the range from the base address to
the 0x4000 address is used.
This patch fixed it.
Fixes: 13ee2bfc54 ("arm64: dts: renesas: r8a77990: Add display output support")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables TI HD3SS3220 device and support usb role switch
for the CAT 874 platform.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables USB3.0 host/peripheral device node for the cat874
board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the new renesas,companion property to the LVDS0 node to point to the
companion LVDS encoder LVDS1.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Tested-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Enable RWDT and use 60 seconds as default timeout.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables PCIEC[01] PCI express controller on the sub board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Declare pcie bus clock, since it is generated on the HiHope RZ/G2M main
board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds pincontrol support to scif2/scif clock.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the HiHope RZ/G2M main board:
- Memory,
- Main crystal,
- Serial console
This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.
The operating points for the cluster with the A57s are:
Frequency | Voltage
-----------|---------
500 MHz | 0.82V
1.0 GHz | 0.82V
1.5 GHz | 0.82V
The operating points for the cluster with the A53s are:
Frequency | Voltage
-----------|---------
800 MHz | 0.82V
1.0 GHz | 0.82V
1.2 GHz | 0.82V
This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe the dynamic power coefficient of A57 and A53 CPUs.
Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A5 cooling device supports 5 cooling states which can be categorised as
follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.
As per 87c059e9c3 ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:
Steps to reproduce:
- start AVB TX stream (Using aplay via MSE),
- disconnect+reconnect the eth cable,
- after a reconnection the eth connection goes iteratively up/down
without user interaction,
- this may heal after some seconds or even stay for minutes.
As the documentation specifies, the "renesas,no-ether-link" option
should be used when a board does not provide a proper AVB_LINK signal.
There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
and ULCB starter kits since the AVB_LINK is correctly handled by HW.
Choosing to keep or remove the "renesas,no-ether-link" option will have
impact on the code flow in the following ways:
- keeping this option enabled may lead to unexpected behavior since the
RX & TX are enabled/disabled directly from adjust_link function
without any HW interrogation,
- removing this option, the RX & TX will only be enabled/disabled after
HW interrogation. The HW check is made through the LMON pin in PSR
register which specifies AVB_LINK signal value (0 - at low level;
1 - at high level).
In conclusion, the present change is also a safety improvement because
it removes the "renesas,no-ether-link" option leading to a proper way
of detecting the link state based on HW interrogation and not on
software heuristic.
Fixes: 8441ef643d ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Apparently this DTS crossed over with commit 31af04cd60 ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Convert bootargs from ip=dhcp to ip=on
Signed-off-by: Magnus Damm <damm+renesas@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables BT support for the CAT874 board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables WLAN support for the CAT874 board.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a7795 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a77965 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Tested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add tpu device node to dtsi for TPU support on r8a7796 SoC.
Signed-off-by: Cao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds description of TI WL1837 and links interfaces
to communicate with the IC, namely the SDIO interface to WLAN.
Signed-off-by: Spyridon Papageorgiou <spapageorgiou@de.adit-jv.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The ports node of vin4 only has one sub-node and thus does
not need #address-cells/#size-cells and the sub-node does
not need an exit.
This addresses the following warning:
# make dtbs W=1
...
arch/arm64/boot/dts/renesas/r8a77995-draak.dts:492.8-503.4: Warning (graph_child_address): /soc/video@e6ef4000/ports: graph node has single child node 'port@0', #address-cells/#size-cells are not necessary
Fixes: 6a0942c20f ("arm64: dts: renesas: draak: Describe CVBS input")
Cc: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
The CAT874 board pushes sound via I2S over SSI0 into the
TDA19988BET chip.
This commit wires things up so that we can get sound out of
the HDMI interface.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The CAT874 board comes with a HDMI connector, managed by
a TDA19988BET chip, connected to the RZ/G2E SoC via DPAD.
This patch adds the necessary support to the board DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add IPMMU-DS0 to the Ethernet-AVB device node.
Based on work by Magnus Damm for the r8a7795.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up r8a774a1 Audio-DMAC nodes to the IPMMU-MP.
Based on work for the r8a7795 by Magnus Damm.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up r8a774a1 DMAC nodes to the IPMMUs. In particular SYS-DMAC0
gets tied to IPMMU-DS0, and SYS-DMAC1 and SYS-DMAC2 get tied to IPMMU-DS1.
Based on work for the r8a7796 by Magnus Damm.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The r8a774a1 has a single FDP1 instance similar to r8a7796.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the DU device to r8a774a1.dtsi in a disabled state.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The r8a774a1 soc has 5 VSP instances similar to r8a7796.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Pull IRQ chip updates from Ingo Molnar:
"A late irqchips update:
- New TI INTR/INTA set of drivers
- Rewrite of the stm32mp1-exti driver as a platform driver
- Update the IOMMU MSI mapping API to be RT friendly
- A number of cleanups and other low impact fixes"
* 'irq-urgent-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip: (34 commits)
iommu/dma-iommu: Remove iommu_dma_map_msi_msg()
irqchip/gic-v3-mbi: Don't map the MSI page in mbi_compose_m{b, s}i_msg()
irqchip/ls-scfg-msi: Don't map the MSI page in ls_scfg_msi_compose_msg()
irqchip/gic-v3-its: Don't map the MSI page in its_irq_compose_msi_msg()
irqchip/gicv2m: Don't map the MSI page in gicv2m_compose_msi_msg()
iommu/dma-iommu: Split iommu_dma_map_msi_msg() in two parts
genirq/msi: Add a new field in msi_desc to store an IOMMU cookie
arm64: arch_k3: Enable interrupt controller drivers
irqchip/ti-sci-inta: Add msi domain support
soc: ti: Add MSI domain bus support for Interrupt Aggregator
irqchip/ti-sci-inta: Add support for Interrupt Aggregator driver
dt-bindings: irqchip: Introduce TISCI Interrupt Aggregator bindings
irqchip/ti-sci-intr: Add support for Interrupt Router driver
dt-bindings: irqchip: Introduce TISCI Interrupt router bindings
gpio: thunderx: Use the default parent apis for {request,release}_resources
genirq: Introduce irq_chip_{request,release}_resource_parent() apis
firmware: ti_sci: Add helper apis to manage resources
firmware: ti_sci: Add RM mapping table for am654
firmware: ti_sci: Add support for IRQ management
firmware: ti_sci: Add support for RM core ops
...
This is some material that we picked up into our tree late. Most of it
are smaller fixes and additions, some defconfig updates due to recent
development, etc.
Code-wise the largest portion is a series of PM updates for the at91
platform, and those have been in linux-next a while through the at91
tree before we picked them up.
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Merge tag 'armsoc-late' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc
Pull ARM SoC late updates from Olof Johansson:
"This is some material that we picked up into our tree late. Most of it
are smaller fixes and additions, some defconfig updates due to recent
development, etc.
Code-wise the largest portion is a series of PM updates for the at91
platform, and those have been in linux-next a while through the at91
tree before we picked them up"
* tag 'armsoc-late' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (29 commits)
arm64: dts: sprd: Add clock properties for serial devices
Opt out of scripts/get_maintainer.pl
ARM: ixp4xx: Remove duplicated include from common.c
soc: ixp4xx: qmgr: Fix an NULL vs IS_ERR() check in probe
arm64: tegra: Disable XUSB support on Jetson TX2
arm64: tegra: Enable SMMU translation for PCI on Tegra186
arm64: tegra: Fix insecure SMMU users for Tegra186
arm64: tegra: Select ARM_GIC_PM
amba: tegra-ahb: Mark PM functions as __maybe_unused
ARM: dts: logicpd-som-lv: Fix MMC1 card detect
ARM: mvebu: drop return from void function
ARM: mvebu: prefix coprocessor operand with p
ARM: mvebu: drop unnecessary label
ARM: mvebu: fix a leaked reference by adding missing of_node_put
ARM: socfpga_defconfig: enable LTC2497
ARM: mvebu: kirkwood: remove error message when retrieving mac address
ARM: at91: sama5: make ov2640 as a module
ARM: OMAP1: ams-delta: fix early boot crash when LED support is disabled
ARM: at91: remove HAVE_FB_ATMEL for sama5 SoC as they use DRM
soc/fsl/qe: Fix an error code in qe_pin_request()
...
* POWER: support for direct access to the POWER9 XIVE interrupt controller,
memory and performance optimizations.
* x86: support for accessing memory not backed by struct page, fixes and refactoring
* Generic: dirty page tracking improvements
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Merge tag 'for-linus' of git://git.kernel.org/pub/scm/virt/kvm/kvm
Pull KVM updates from Paolo Bonzini:
"ARM:
- support for SVE and Pointer Authentication in guests
- PMU improvements
POWER:
- support for direct access to the POWER9 XIVE interrupt controller
- memory and performance optimizations
x86:
- support for accessing memory not backed by struct page
- fixes and refactoring
Generic:
- dirty page tracking improvements"
* tag 'for-linus' of git://git.kernel.org/pub/scm/virt/kvm/kvm: (155 commits)
kvm: fix compilation on aarch64
Revert "KVM: nVMX: Expose RDPMC-exiting only when guest supports PMU"
kvm: x86: Fix L1TF mitigation for shadow MMU
KVM: nVMX: Disable intercept for FS/GS base MSRs in vmcs02 when possible
KVM: PPC: Book3S: Remove useless checks in 'release' method of KVM device
KVM: PPC: Book3S HV: XIVE: Fix spelling mistake "acessing" -> "accessing"
KVM: PPC: Book3S HV: Make sure to load LPID for radix VCPUs
kvm: nVMX: Set nested_run_pending in vmx_set_nested_state after checks complete
tests: kvm: Add tests for KVM_SET_NESTED_STATE
KVM: nVMX: KVM_SET_NESTED_STATE - Tear down old EVMCS state before setting new state
tests: kvm: Add tests for KVM_CAP_MAX_VCPUS and KVM_CAP_MAX_CPU_ID
tests: kvm: Add tests to .gitignore
KVM: Introduce KVM_CAP_MANUAL_DIRTY_LOG_PROTECT2
KVM: Fix kvm_clear_dirty_log_protect off-by-(minus-)one
KVM: Fix the bitmap range to copy during clear dirty
KVM: arm64: Fix ptrauth ID register masking logic
KVM: x86: use direct accessors for RIP and RSP
KVM: VMX: Use accessors for GPRs outside of dedicated caching logic
KVM: x86: Omit caching logic for always-available GPRs
kvm, x86: Properly check whether a pfn is an MMIO or not
...
Pull more vfs mount updates from Al Viro:
"Propagation of new syscalls to other architectures + cosmetic change
from Christian (fscontext didn't follow the convention for anon inode
names)"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/viro/vfs:
uapi: Wire up the mount API syscalls on non-x86 arches [ver #2]
uapi, x86: Fix the syscall numbering of the mount API syscalls [ver #2]
uapi, fsopen: use square brackets around "fscontext" [ver #2]
We've introduced power management logics for the Spreadtrum serial
controller by commit 062ec2774c8a ("serial: sprd: Add power management
for the Spreadtrum serial controller"), thus add related clock properties
to support this feature.
Signed-off-by: Baolin Wang <baolin.wang@linaro.org>
Signed-off-by: Olof Johansson <olof@lixom.net>
