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https://github.com/AuxXxilium/linux_dsm_epyc7002.git
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724adec33c
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com |
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| .. | ||
| broadcom | ||
| intel | ||
| qcom | ||
| samsung | ||
| st | ||
| tegra | ||
| ti-soc-thermal | ||
| armada_thermal.c | ||
| clock_cooling.c | ||
| cpu_cooling.c | ||
| da9062-thermal.c | ||
| db8500_thermal.c | ||
| devfreq_cooling.c | ||
| dove_thermal.c | ||
| fair_share.c | ||
| gov_bang_bang.c | ||
| hisi_thermal.c | ||
| imx_thermal.c | ||
| Kconfig | ||
| kirkwood_thermal.c | ||
| Makefile | ||
| max77620_thermal.c | ||
| mtk_thermal.c | ||
| of-thermal.c | ||
| power_allocator.c | ||
| qoriq_thermal.c | ||
| rcar_gen3_thermal.c | ||
| rcar_thermal.c | ||
| rockchip_thermal.c | ||
| spear_thermal.c | ||
| step_wise.c | ||
| tango_thermal.c | ||
| thermal_core.c | ||
| thermal_core.h | ||
| thermal_helpers.c | ||
| thermal_hwmon.c | ||
| thermal_hwmon.h | ||
| thermal_mmio.c | ||
| thermal_sysfs.c | ||
| thermal-generic-adc.c | ||
| uniphier_thermal.c | ||
| user_space.c | ||
| zx2967_thermal.c | ||