Eduardo Valentin 57d1617137 thermal: ti-soc-thermal: use standard GPIO DT bindings ... This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>		2013-07-08 10:11:59 -04:00
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dra752-bandgap.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
dra752-thermal-data.c	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
Kconfig	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
Makefile	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
omap4-thermal-data.c	thermal: introduce TI SoC thermal driver	2013-05-28 10:40:37 +08:00
omap4xxx-bandgap.h	thermal: introduce TI SoC thermal driver	2013-05-28 10:40:37 +08:00
omap5-thermal-data.c	thermal: introduce TI SoC thermal driver	2013-05-28 10:40:37 +08:00
omap5xxx-bandgap.h	thermal: introduce TI SoC thermal driver	2013-05-28 10:40:37 +08:00
ti-bandgap.c	thermal: ti-soc-thermal: use standard GPIO DT bindings	2013-07-08 10:11:59 -04:00
ti-bandgap.h	thermal: ti-soc-thermal: add dra752 chip to device table	2013-06-13 10:16:07 +08:00
ti-thermal-common.c	thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL	2013-06-13 10:14:00 +08:00
ti-thermal.h	thermal: ti-soc-thermal: add thermal data for DRA752 chips	2013-06-13 10:15:52 +08:00
TODO	thermal: introduce TI SoC thermal driver	2013-05-28 10:40:37 +08:00