linux_dsm_epyc7002/Documentation/devicetree/bindings/vendor-prefixes.txt
Linus Torvalds eb785bef68 ARM: SoC DT updates for 3.18
As usual, this is the largest branch, though this time a little under
 half of the total changes with 307 individual non-merge changesets.
 
 The largest changes are the addition of new machines, in particular
 the Tegra based Chromebook, the Renesas r8a7794 SoC, and DT support
 for the old i.MX1 platform.
 
 Other changes include
 - at91: various sam9 and sama5 updates
 - exynos: much extended Peach Pi/Pit (Chromebook 2) support
 - keystone: new peripherals
 - meson: added DT for meson6 SoC
 - mvebu: new device support for Armada 370/375
 - qcom: improved support for IPQ8064 and MSM8x60
 - rockchip: much improved support for rk3288
 - shmobile: lots of updates all over the place
 - sunxi: dts license change
 - sunxi: more a23 device support
 - vexpress: CLCD DT description
 -----BEGIN PGP SIGNATURE-----
 Version: GnuPG v1.4.12 (GNU/Linux)
 
 iQIVAwUAVDWVG2CrR//JCVInAQJmARAAnU2I4VpJHlBeHC4CYr/GdRq0NqiFvQ38
 7N/zevUI4l150DtejltbOX71JGM9vD3hq8VXZYBCEpTbG4el9PzAq28Fomtt4tmC
 PGbczQY8ZMvY1/MOT3XLZAd3TSUL0TZRt97t9bdLif6QyPafel5o2pd8D2OG7h+L
 Awtyk9LobT9jU3muFX3ZUfB3Gg2sNKphZjox9Le3gVjGd6g5teEqqMAehK2Y7ArJ
 kixrKck4vgduDdZe59o2yApAUsfIQv/joqu68jv3MUQrKmk4s543+rIdGDuLF5bz
 mEo7qtMXujoNaF3CyLYNEF2ZExIOJDdtmrwjHY8oKIFtIeI/faIJmeSChwa6794t
 Njj5bbnL0Pt61l4gUSFk2hUFo28gpiEB+Mm0R4E1hdoG15Iv6E+lpy44EmEmfz1c
 9h0sATNGUrz18IrUk7jI1WwIaEJUwkbZ+8wKuWtvH+Z+mFA4ZlDykVcnVuELixpb
 vKmI3kcmEw2RsJjkYq3LcgXXQevE4mHRR1ow59yXTY6OR1LmVb7odKUwbrweofQO
 eytVb1deMeYXrBXT5/j6WmrlyDbYcuGsjO4WidT+zwYUiAMCE6bTpNwUWqumVEUv
 LjCBaN6BRIb89EBwt4xIvIu7ir9hNNRZnD8aa4afSzIYxknzZy73pjjT2+wu7jbU
 m15TwYyQG4E=
 =2Sq1
 -----END PGP SIGNATURE-----

Merge tag 'dt-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC DT updates from Arnd Bergmann:
 "As usual, this is the largest branch, though this time a little under
  half of the total changes with 307 individual non-merge changesets.

  The largest changes are the addition of new machines, in particular
  the Tegra based Chromebook, the Renesas r8a7794 SoC, and DT support
  for the old i.MX1 platform.

  Other changes include
   - at91: various sam9 and sama5 updates
   - exynos: much extended Peach Pi/Pit (Chromebook 2) support
   - keystone: new peripherals
   - meson: added DT for meson6 SoC
   - mvebu: new device support for Armada 370/375
   - qcom: improved support for IPQ8064 and MSM8x60
   - rockchip: much improved support for rk3288
   - shmobile: lots of updates all over the place
   - sunxi: dts license change
   - sunxi: more a23 device support
   - vexpress: CLCD DT description"

* tag 'dt-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (308 commits)
  ARM: DTS: meson: update DTSI to add watchdog node
  ARM: dts: keystone-k2l: fix mdio io start address
  ARM: dts: keystone-k2e: fix mdio io start address
  ARM: dts: keystone-k2e: update usb1 node for dma properties
  ARM: dts: keystone: fix io range for usb_phy0
  Revert "Merge tag 'hix5hd2-dt-for-3.18' of git://github.com/hisilicon/linux-hisi into next/dt"
  Revert "ARM: dts: hix5hd2: add wdg node"
  ARM: dts: add rk3288 i2s controller
  ARM: vexpress: Add CLCD Device Tree properties
  ARM: bcm2835: add I2S pinctrl to device tree
  ARM: meson: documentation: add bindings documentation
  ARM: meson: dts: add basic Meson/Meson6/Meson6-atv1200 DTSI/DTS
  ARM: dts: mt6589: Change compatible string for GIC
  ARM: dts: mediatek: Add compatible property for aquaris5
  ARM: dts: mt6589-aquaris5: Add boot argument earlyprintk
  ARM: dts: mt6589: Fix typo in GIC unit address
  ARM: dts: Build dtb for Mediatek board
  ARM: dts: keystone: fix bindings for pcie and usb clock nodes
  ARM: dts: keystone: k2l: Fix chip selects for SPI devices
  ARM: dts: keystone: add dsp gpio controllers nodes
  ...
2014-10-08 17:22:23 -04:00

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
abilis Abilis Systems
active-semi Active-Semi International Inc
ad Avionic Design GmbH
adapteva Adapteva, Inc.
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
allwinner Allwinner Technology Co., Ltd.
altr Altera Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
amd Advanced Micro Devices (AMD), Inc.
amlogic Amlogic, Inc.
ams AMS AG
amstaos AMS-Taos Inc.
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
armadeus ARMadeus Systems SARL
atmel Atmel Corporation
auo AU Optronics Corporation
avago Avago Technologies
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
buffalo Buffalo, Inc.
calxeda Calxeda
capella Capella Microsystems, Inc
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
chipidea Chipidea, Inc
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
crystalfontz Crystalfontz America, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
digi Digi International Inc.
dlg Dialog Semiconductor
dlink D-Link Corporation
dmo Data Modul AG
ebv EBV Elektronik
edt Emerging Display Technologies
emmicro EM Microelectronic
epcos EPCOS AG
epfl Ecole Polytechnique Fédérale de Lausanne
epson Seiko Epson Corp.
est ESTeem Wireless Modems
eukrea Eukréa Electromatique
excito Excito
fcs Fairchild Semiconductor
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
geniatech Geniatech, Inc.
globalscale Globalscale Technologies, Inc.
gmt Global Mixed-mode Technology, Inc.
google Google, Inc.
gumstix Gumstix, Inc.
haoyu Haoyu Microelectronic Co. Ltd.
hisilicon Hisilicon Limited.
honeywell Honeywell
hp Hewlett Packard
i2se I2SE GmbH
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
iom Iomega Corporation
img Imagination Technologies Ltd.
intel Intel Corporation
intercontrol Inter Control Group
isee ISEE 2007 S.L.
isl Intersil
karo Ka-Ro electronics GmbH
keymile Keymile GmbH
lacie LaCie
lantiq Lantiq Semiconductor
lenovo Lenovo Group Ltd.
lg LG Corporation
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
lltc Linear Technology Corporation
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
mediatek MediaTek Inc.
micrel Micrel Inc.
microchip Microchip Technology Inc.
mosaixtech Mosaix Technologies, Inc.
moxa Moxa
mpl MPL AG
mundoreader Mundo Reader S.L.
murata Murata Manufacturing Co., Ltd.
mxicy Macronix International Co., Ltd.
national National Semiconductor
neonode Neonode Inc.
netgear NETGEAR
newhaven Newhaven Display International
nintendo Nintendo
nokia Nokia
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
opencores OpenCores.org
panasonic Panasonic Corporation
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
plathome Plat'Home Co., Ltd.
pixcir PIXCIR MICROELECTRONICS Co., Ltd
powervr PowerVR (deprecated, use img)
qca Qualcomm Atheros, Inc.
qcom Qualcomm Technologies, Inc
qnap QNAP Systems, Inc.
radxa Radxa
raidsonic RaidSonic Technology GmbH
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
ricoh Ricoh Co. Ltd.
rockchip Fuzhou Rockchip Electronics Co., Ltd
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
seagate Seagate Technology PLC
sil Silicon Image
silabs Silicon Laboratories
simtek
sii Seiko Instruments, Inc.
silergy Silergy Corp.
sirf SiRF Technology, Inc.
smsc Standard Microsystems Corporation
snps Synopsys, Inc.
solidrun SolidRun
spansion Spansion Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
synology Synology, Inc.
ti Texas Instruments
tlm Trusted Logic Mobility
toradex Toradex AG
toshiba Toshiba Corporation
toumaz Toumaz
usi Universal Scientific Industrial Co., Ltd.
v3 V3 Semiconductor
variscite Variscite Ltd.
via VIA Technologies, Inc.
voipac Voipac Technologies s.r.o.
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
xes Extreme Engineering Solutions (X-ES)
xillybus Xillybus Ltd.
xlnx Xilinx
zyxel ZyXEL Communications Corp.
zarlink Zarlink Semiconductor