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1b678641c2
This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
18 lines
698 B
Plaintext
18 lines
698 B
Plaintext
config EXYNOS_THERMAL
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tristate "Exynos thermal management unit driver"
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depends on ARCH_HAS_BANDGAP
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help
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If you say yes here you get support for the TMU (Thermal Management
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Unit) driver for SAMSUNG EXYNOS series of soc. This driver initialises
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the TMU, reports temperature and handles cooling action if defined.
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This driver uses the exynos core thermal API's.
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config EXYNOS_THERMAL_CORE
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bool "Core thermal framework support for EXYNOS SOC's"
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depends on EXYNOS_THERMAL
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help
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If you say yes here you get support for EXYNOS TMU
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(Thermal Management Unit) common registration/unregistration
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functions to the core thermal layer and also to use the generic
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cpu cooling API's.
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