DRA7xx/AM57xx SoCs have two IPU and up to two DSP processor subsystems
for offloading different computation algorithms. The IPU processor
subsystem contains dual-core ARM Cortex-M4 processors, and is very
similar to those on OMAP5. The DSP processor subsystem is based on
the TI's standard TMS320C66x DSP CorePac core.
Support has been added to the OMAP remoteproc driver through new
DRA7xx specific compatibles for properly probing and booting all
the different processor subsystem instances on DRA7xx/AM57xx
SoCs - IPU1, IPU2, DSP1 & DSP2. A build dependency with SOC_DRA7XX
is added to enable the driver to be built in DRA7xx-only configuration.
The DSP boot address programming needed enhancement for DRA7xx as the
boot register fields are different on DRA7 compared to OMAP4 and OMAP5
SoCs. The register on DRA7xx contains additional fields within the
register and the boot address bit-field is right-shifted by 10 bits.
The internal memory parsing logic has also been updated to compute
the device addresses for the L2 RAM for DSP devices using relative
addressing logic, and to parse two additional RAMs at L1 level - L1P
and L1D. This allows the remoteproc driver to support loading into
these regions for a small subset of firmware images requiring as
such. The most common usage would be to use the L1 programmable
RAMs as L1 Caches.
The firmware lookup logic also has to be adjusted for DRA7xx as
there are (can be) more than one instance of both the IPU and DSP
remote processors for the first time in OMAP4+ SoCs.
Signed-off-by: Suman Anna <s-anna@ti.com>
[t-kristo@ti.com: moved address translation quirks to pdata]
Signed-off-by: Tero Kristo <t-kristo@ti.com>
Reviewed-by: Andrew F. Davis <afd@ti.com>
Acked-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Link: https://lore.kernel.org/r/20200324110035.29907-8-t-kristo@ti.com
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
0aaf191302