During probe the regulator (if present) was enabled but not disabled in
case of failure. So an unsuccessful probe lead to enabling the
regulator which was actually not needed because the device was not
enabled.
Additionally each deferred probe lead to increase of regulator enable
count so it would not be effectively disabled during removal of the
device.
Test HW: Exynos4412 - Trats2 board
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Fixes: 498d22f616 ("thermal: exynos: Support for TMU regulator defined at device tree")
Cc: <stable@vger.kernel.org>
Reviewed-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor uses ftrace to output a bunch of internal
data for debugging and tuning. Currently, the requested power it
outputs is the "weighted" requested power, that is, what each cooling
device has requested multiplied by the cooling device weight. It is
more useful to trace the real request, without any weight being
applied.
This commit only affects the data traced, there is no functional change.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Now that there is no paravirt TSC, the "native" is
inappropriate. The function does RDTSC, so give it the obvious
name: rdtsc().
Suggested-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Andy Lutomirski <luto@kernel.org>
Signed-off-by: Borislav Petkov <bp@suse.de>
Cc: Andy Lutomirski <luto@amacapital.net>
Cc: Borislav Petkov <bp@alien8.de>
Cc: Brian Gerst <brgerst@gmail.com>
Cc: Denys Vlasenko <dvlasenk@redhat.com>
Cc: H. Peter Anvin <hpa@zytor.com>
Cc: Huang Rui <ray.huang@amd.com>
Cc: John Stultz <john.stultz@linaro.org>
Cc: Len Brown <lenb@kernel.org>
Cc: Linus Torvalds <torvalds@linux-foundation.org>
Cc: Peter Zijlstra <peterz@infradead.org>
Cc: Ralf Baechle <ralf@linux-mips.org>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: kvm ML <kvm@vger.kernel.org>
Link: http://lkml.kernel.org/r/fd43e16281991f096c1e4d21574d9e1402c62d39.1434501121.git.luto@kernel.org
[ Ported it to v4.2-rc1. ]
Signed-off-by: Ingo Molnar <mingo@kernel.org>
Now that the ->read_tsc() paravirt hook is gone, rdtscll() is
just a wrapper around native_read_tsc(). Unwrap it.
Signed-off-by: Andy Lutomirski <luto@kernel.org>
Signed-off-by: Borislav Petkov <bp@suse.de>
Cc: Andy Lutomirski <luto@amacapital.net>
Cc: Borislav Petkov <bp@alien8.de>
Cc: Brian Gerst <brgerst@gmail.com>
Cc: Denys Vlasenko <dvlasenk@redhat.com>
Cc: H. Peter Anvin <hpa@zytor.com>
Cc: Huang Rui <ray.huang@amd.com>
Cc: John Stultz <john.stultz@linaro.org>
Cc: Len Brown <lenb@kernel.org>
Cc: Linus Torvalds <torvalds@linux-foundation.org>
Cc: Peter Zijlstra <peterz@infradead.org>
Cc: Ralf Baechle <ralf@linux-mips.org>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: kvm ML <kvm@vger.kernel.org>
Link: http://lkml.kernel.org/r/d2449ae62c1b1fb90195bcfb19ef4a35883a04dc.1434501121.git.luto@kernel.org
Signed-off-by: Ingo Molnar <mingo@kernel.org>
Main excitement here is Peter Zijlstra's lockless rbtree optimization to
speed module address lookup. He found some abusers of the module lock
doing that too.
A little bit of parameter work here too; including Dan Streetman's breaking
up the big param mutex so writing a parameter can load another module (yeah,
really). Unfortunately that broke the usual suspects, !CONFIG_MODULES and
!CONFIG_SYSFS, so those fixes were appended too.
Cheers,
Rusty.
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Merge tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux
Pull module updates from Rusty Russell:
"Main excitement here is Peter Zijlstra's lockless rbtree optimization
to speed module address lookup. He found some abusers of the module
lock doing that too.
A little bit of parameter work here too; including Dan Streetman's
breaking up the big param mutex so writing a parameter can load
another module (yeah, really). Unfortunately that broke the usual
suspects, !CONFIG_MODULES and !CONFIG_SYSFS, so those fixes were
appended too"
* tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux: (26 commits)
modules: only use mod->param_lock if CONFIG_MODULES
param: fix module param locks when !CONFIG_SYSFS.
rcu: merge fix for Convert ACCESS_ONCE() to READ_ONCE() and WRITE_ONCE()
module: add per-module param_lock
module: make perm const
params: suppress unused variable error, warn once just in case code changes.
modules: clarify CONFIG_MODULE_COMPRESS help, suggest 'N'.
kernel/module.c: avoid ifdefs for sig_enforce declaration
kernel/workqueue.c: remove ifdefs over wq_power_efficient
kernel/params.c: export param_ops_bool_enable_only
kernel/params.c: generalize bool_enable_only
kernel/module.c: use generic module param operaters for sig_enforce
kernel/params: constify struct kernel_param_ops uses
sysfs: tightened sysfs permission checks
module: Rework module_addr_{min,max}
module: Use __module_address() for module_address_lookup()
module: Make the mod_tree stuff conditional on PERF_EVENTS || TRACING
module: Optimize __module_address() using a latched RB-tree
rbtree: Implement generic latch_tree
seqlock: Introduce raw_read_seqcount_latch()
...
Pull thermal management updates from Zhang Rui:
"Specifics:
- enhance Thermal Framework with several new capabilities:
* use power estimates
* compute weights with relative integers instead of percentages
* allow governors to have private data in thermal zones
* export thermal zone parameters through sysfs
Thanks to the ARM thermal team (Javi, Punit, KP).
- introduce a new thermal governor: power allocator. First in kernel
closed loop PI(D) controller for thermal control. Thanks to ARM
thermal team.
- enhance OF thermal to allow thermal zones to have sustainable power
HW specification. Thanks to Punit.
- introduce thermal driver for Intel Quark SoC x1000platform. Thanks
to Ong, Boon Leong.
- introduce QPNP PMIC temperature alarm driver. Thanks to Ivan T. I.
- introduce thermal driver for Hisilicon hi6220. Thanks to
kongxinwei.
- enhance Exynos thermal driver to handle Exynos5433 TMU. Thanks to
Chanwoo C.
- TI thermal driver now has a better implementation for EOCZ bit.
From Pavel M.
- add id for Skylake processors in int340x processor thermal driver.
- a couple of small fixes and cleanups."
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
thermal: hisilicon: add new hisilicon thermal sensor driver
dt-bindings: Document the hi6220 thermal sensor bindings
thermal: of-thermal: add support for reading coefficients property
thermal: support slope and offset coefficients
thermal: power_allocator: round the division when divvying up power
thermal: exynos: Add the support for Exynos5433 TMU
thermal: cpu_cooling: Fix power calculation when CPUs are offline
thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
thermal: export thermal_zone_parameters to sysfs
thermal: cpu_cooling: Check memory allocation of power_table
ti-soc-thermal: request temperature periodically if hw can't do that itself
ti-soc-thermal: implement eocz bit to make driver useful on omap3
cleanup ti-soc-thermal
thermal: remove stale THERMAL_POWER_ACTOR select
thermal: Default OF created trip points to writable
thermal: core: Add Kconfig option to enable writable trips
thermal: x86_pkg_temp: drop const for thermal_zone_parameters
of: thermal: Introduce sustainable power for a thermal zone
thermal: add trace events to the power allocator governor
thermal: introduce the Power Allocator governor
...
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Most code already uses consts for the struct kernel_param_ops,
sweep the kernel for the last offending stragglers. Other than
include/linux/moduleparam.h and kernel/params.c all other changes
were generated with the following Coccinelle SmPL patch. Merge
conflicts between trees can be handled with Coccinelle.
In the future git could get Coccinelle merge support to deal with
patch --> fail --> grammar --> Coccinelle --> new patch conflicts
automatically for us on patches where the grammar is available and
the patch is of high confidence. Consider this a feature request.
Test compiled on x86_64 against:
* allnoconfig
* allmodconfig
* allyesconfig
@ const_found @
identifier ops;
@@
const struct kernel_param_ops ops = {
};
@ const_not_found depends on !const_found @
identifier ops;
@@
-struct kernel_param_ops ops = {
+const struct kernel_param_ops ops = {
};
Generated-by: Coccinelle SmPL
Cc: Rusty Russell <rusty@rustcorp.com.au>
Cc: Junio C Hamano <gitster@pobox.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Kees Cook <keescook@chromium.org>
Cc: Tejun Heo <tj@kernel.org>
Cc: Ingo Molnar <mingo@kernel.org>
Cc: cocci@systeme.lip6.fr
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Luis R. Rodriguez <mcgrof@suse.com>
Signed-off-by: Rusty Russell <rusty@rustcorp.com.au>
In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.
The supported equation is a simple linear model:
slope * <sensor reading> + offset.
slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.
So, as of today, the thermal framework will support
only cases like:
/* hotspot = 1 * adc + 6000 */
coefficients = <1 6000>;
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors. This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power. So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.
Round the division to make the calculation more accurate.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
There is a copy and paste bug, "->clk" vs "->pclk", so we return the
wrong error code here.
Fixes: cbac8f6394 ('thermal: rockchip: add driver for thermal')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Doug Anderson <dianders@chromium.org>
Tested-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Package C8 to C10 was introduced in newer Intel CPUs, we need to
include them in the package c-state residency calculation.
Otherwise, idle injection target is not accurately maintained by
the closed control loop.
Also cleaned up the code to make it scale better with large number
of c-states.
Reported-by: Kristen Carlson Accardi <kristen@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Broadwell server has support for package C-states, idle injection works
as expected on this platform.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Mark the module init / exit functions with __init / __exit accodingly.
This allows making the intel_powerclamp_ids[] array __initconst, too, as
it only gets referenced from powerclamp_probe(). This is safe as
file2alias doesn't care about the section, but the symbol name for the
MODULE_DEVICE_TABLE alias.
Cc: Arjan van de Ven <arjan@linux.intel.com>
Cc: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Mathias Krause <minipli@googlemail.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
DESCRIPTION
Spurious Thermal Alert: Talert can happen randomly while the device remains
under the temperature limit defined for this event to trig. This spurious
event is caused by a incorrect re-synchronization between clock domains.
The comparison between configured threshold and current temperature value
can happen while the value is transitioning (metastable), thus causing
inappropriate event generation. No spurious event occurs as long as the
threshold value stays unchanged. Spurious event can be generated while a
thermal alert threshold is modified in
CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n.
WORKAROUND
Spurious event generation can be avoided by performing following sequence
when the threshold is modified:
1. Mask the hot/cold events at the thermal IP level.
2. Modify Threshold.
3. Unmask the hot/cold events at the thermal IP level.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Bandgap Temperature read Dtemp can be corrupted
DESCRIPTION
Read accesses to registers listed below can be corrupted due to
incorrect resynchronization between clock domains.
Read access to registers below can be corrupted :
• CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4)
• CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n
WORKAROUND
Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]:
BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and
read right value:
1. Perform two successive reads to BGAP_DTEMP bit field.
(a) If read1 returns Val1 and read2 returns Val1, then
right value is Val1.
(b) If read1 returns Val1, read 2 returns Val2, a third
read is needed.
2. Perform third read
(a) If read3 returns Val2 then right value is Val2.
(b) If read3 returns Val3, then right value is Val3.
The above in gist means if val1 and val2 are the same then we can go
ahead with that value else we need a third read which will be right
since synchronization will be complete by then.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch adds the support for Exynos5433's TMU (Thermal Management Unit).
Exynos5433 has a little different register bit fields as following description:
- Support the eight trip points for rising/falling interrupt by using two registers
- Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register
- Use a little different register address
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Ensure that the CPU for which the frequency is being requested
is online. If none of the CPUs are online the requested power is
returned as 0.
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It was initially understood that an update to the cpu_device
(cached in cpufreq_cooling_device) was required to ascertain the
correct operating point of the device on a cpufreq policy->cpu update
or creation or deletion of a cpufreq policy.
(e.g. when the existing policy CPU goes offline).
This update is not required and it is possible to ascertain the OPPs
from the leading CPU in a cpufreq domain even if the CPU is hotplugged out.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace. Export them to the thermal_zone sysfs so that they can be
easily changed.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
We allocate the power_table in memory but we don't test whether the
allocation succeeded. Return -ENOMEM if kcalloc() fails.
Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When periodic mode is not enabled, it is neccessary to force reads.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
For omap3, proper implementation of eocz bit is needed. It was
actually a TODO in the driver.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Simplify code by removing goto's where they point to simple return.
Avoid confusing |= on error values.
Correct whitespace.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped. Remove the select as it is not doing anything.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.
This allows the trip points to be tweaked after the system has
booted.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.
The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped
the const attribute in the struct thermal_zone_device. That means that
the thermal_zone_params pointer passed to thermal_zone_device_register()
also lost the const qualifier. Drop the const in x86_pkg_temp_thermal.c
as well to avoid the following warning as reported by the kbuild test
robot:
drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add':
>> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type
phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0);
^
In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0:
include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *'
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
^
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.
If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a basic power model to the cpu cooling device to implement the
power cooling device API. The power model uses the current frequency,
current load and OPPs for the power calculations. The cpus must have
registered their OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.
Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.
Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them. Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor. Furthermore, this simplifies the code.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch enables intel_powerclamp driver to run on the
next-generation Intel(R) Xeon Phi Microarchitecture
code named "Knights Landing"
Signed-off-by: Dasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
drivers/thermal/intel_soc_dts_iosf.c:358:4-7: WARNING: end returns can be simpified
Simplify a trivial if-return sequence. Possibly combine with a
preceding function call.
Generated by: scripts/coccinelle/misc/simple_return.cocci
CC: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.
However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.
There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.
Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".
User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/
For example:
- to read DTS temperature
$ cat temp
- to read critical trip point
$ cat trip_point_0_temp
- to read trip point type
$ cat trip_point_0_type
- to emulate temperature raise to test orderly shutdown by Linux distro
$ echo 105 > emul_temp
Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Simple patch to make symbols static. Symbols that are not
shared with other parts of the kernel can be made static.
This change also removes several sparse complains.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: Ajit Pal Singh <ajitpal.singh@st.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
of_device_id is always used as const.
(See driver.of_match_table and open firmware functions)
Signed-off-by: Fabian Frederick <fabf@skynet.be>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Some temperature sensors only get updated every few seconds and while
waiting for the first irq reporting a (new) temperature to happen there
get_temp operand will return -EAGAIN as it does not have any data to report
yet.
Not logging an error in this case avoids messages like these from showing
up in dmesg on affected systems:
[ 1.219353] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.015433] thermal thermal_zone0: failed to read out thermal zone 0
[ 2.416737] thermal thermal_zone0: failed to read out thermal zone 0
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Default attributes are created when the device is registered. Attributes
created after device registration can lead to race conditions, where user space
(e.g. udev) sees the device but not the attributes.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When thermal zone device register fails or on module exit, the memory
for aux_trip is not freed. This change fixes this issue.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch fixes the wrong control of PD_DET_EN (power down detection mode)
for Exynos7 because exynos7_tmu_control() always enables the power down detection
mode regardless 'on' parameter.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
It is possible that _ART/_TRT tables are missing or have errors.
Ignore those failures, as INT3400 thermal zone is still required
for _OSC or mode switch.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Enable Intel Powerclamp driver on Atom* Processor C2000 Product
Family for Microservers (Avoton). Avoton - SoCs for micro-servers
has package C-states which can be used for idle injection.
Reported-by: Jose Navarro <jose.navarro@intel.com>
Suggested-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Tested-by: Jose Carlos Venegas Munoz <jos.c.venegas.munoz@intel.com>
Signed-off-by: Miguel Bernal Marin <miguel.bernal.marin@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Swap interrupt disable and thermal zone unregistration in the error and
remove paths, to make them more symmetrical with the initialization
path.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As soon as the interrupt has been enabled by devm_request_irq(), the
interrupt routine may be called, depending on the current status of the
hardware.
However, at that point rcar_thermal_common hasn't been initialized
complely yet. E.g. rcar_thermal_common.base is still NULL, causing a
NULL pointer dereference:
Unable to handle kernel NULL pointer dereference at virtual address 0000000c
pgd = c0004000
[0000000c] *pgd=00000000
Internal error: Oops: 5 [#1] SMP ARM
CPU: 0 PID: 1 Comm: swapper/0 Not tainted 3.19.0-rc7-ape6evm-04564-gb6e46cb7cbe82389 #30
Hardware name: Generic R8A73A4 (Flattened Device Tree)
task: ee8953c0 ti: ee896000 task.ti: ee896000
PC is at rcar_thermal_irq+0x1c/0xf0
LR is at _raw_spin_lock_irqsave+0x48/0x54
Postpone the call to devm_request_irq() until all initialization has
been done to fix this.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Fix following build warning if CONFIG_PM_SLEEP is not set:
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1478:12: warning: 'ti_bandgap_suspend' defined but not used [-Wunused-function]
static int ti_bandgap_suspend(struct device *dev)
^
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1492:12: warning: 'ti_bandgap_resume' defined but not used [-Wunused-function]
static int ti_bandgap_resume(struct device *dev)
^
Acked-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Grygorii Strashko <Grygorii.Strashko@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The exynos_tmu_data() function should on entrance test not only for valid
data pointer, but also for data->tmu_read one.
It is important, since afterwards it is dereferenced to get temperature code.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull more thermal managament updates from Zhang Rui:
"Specifics:
- Exynos thermal driver refactoring. Several cleanups, code
optimization, unused symbols removal, and unused feature removal in
Exynos thermal driver. Thanks Lukasz for this effort.
- Exynos thermal driver support to OF thermal. After the code
refactoring, the driver earned the support to OF thermal. Chip
thermal data were moved from driver code to DTS, reducing the code
footprint. Thanks Lukasz for this.
- After receiving the OF thermal support, the exynos thermal driver
now must allow modular build. Thanks Arnd for detecting, reporting
and fixing this.
- Exynos thermal driver support to Exynos 7 SoC. Thanks Abhilash for
this.
- Accurate temperature reporting on Rockchip thermal driver, thanks
to Caesar.
- Fix on how OF thermal enables its zones, thanks Lukasz for fixing.
- Fixes in OF thermal examples under Documentation/. Thanks Srinivas
for fixing"
* 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: exynos: Add TMU support for Exynos7 SoC
dts: Documentation: Add documentation for Exynos7 SoC thermal bindings
cpufreq: exynos: allow modular build
thermal: Fix examples in DT documentation
thermal: exynos: Correct sanity check at exynos_report_trigger() function
thermal: Kconfig: Remove config for not used EXYNOS_THERMAL_CORE
thermal: exynos: Remove exynos_tmu_data.c file
thermal: rockchip: make temperature reporting much more accurate
thermal: exynos: Remove exynos_thermal_common.[c|h] files
thermal: samsung: core: Exynos TMU rework to use device tree for configuration
dts: Documentation: Update exynos-thermal.txt example for Exynos5440
dts: Documentation: Extending documentation entry for exynos-thermal
cpufreq: exynos: Use device tree to determine if cpufreq cooling should be registered
thermal: exynos: Modify exynos thermal code to use device tree for cpu cooling configuration
thermal: exynos: Provide thermal_exynos.h file to be included in device tree files
thermal: exynos: cosmetic: Correct comment format
thermal: of: Enable thermal_zoneX when sensor is correctly added
Pull thermal managament updates from Zhang Rui:
"Specifics:
- Abstract the code and introduce helper functions for all int340x
thermal drivers. From: Srinivas Pandruvada.
- Reorganize the ACPI LPAT table support code so that it can be
shared for both ACPI PMIC driver and int340x thermal driver.
- Add support for Braswell in intel_soc_dts thermal driver.
- a couple of small fixes/cleanups for step_wise governor and int340x
thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
Thermal/int340x_thermal: remove unused uuids.
thermal: step_wise: spelling fixes
thermal: int340x: fix sparse warning
Thermal/int340x: LPAT conversion for temperature
ACPI / PMIC: Use common LPAT table handling functions
ACPI / LPAT: Common table processing functions
thermal: Intel SoC DTS: Add Braswell support
Thermal/int340x/int3402: Provide notification support
Thermal/int340x/processor_thermal: Add thermal zone support
Thermal/int340x/int3403: Use int340x thermal API
Thermal/int340x/int3402: Use int340x thermal API
Thermal/int340x: Add common thermal zone handler
this patch fixes following sparse warning:
processor_thermal_device.c:188:6: warning: symbol 'proc_thermal_remove' was not declared. Should it be static?
Signed-off-by: Lad, Prabhakar <prabhakar.csengg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add registers, bit fields and compatible strings for Exynos7 TMU
(Thermal Management Unit). Following are a few of the differences
in the Exynos7 TMU from earlier SoCs:
- 8 trigger levels
- Different bit offsets and more registers for the rising
and falling thresholds.
- New power down detection bit in the TMU_CONTROL register
which does not update the CURRENT_TEMP0 when tmu power down
is detected.
- Change in bit offset for the NEXT_DATA field of EMUL_CON
register. EMUL_CON register address has also changed.
- INTSTAT and INTCLEAR registers present in earlier SoCs
have been combined into one INTPEND register. The register
address for INTCLEAR and INTPEND is also different.
- Since there are 8 rising/falling interrupts as against
at most 4 in earlier SoCs the INTEN bit offsets are different.
- Multiple probe support which is handled by a TMU_CONTROL1
register (No support for this in the current patch).
This patch adds special clock support required only for Exynos7. It
also updates the "code_to_temp" prototype as Exynos7 has 9 bit
code-temp mapping.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When LPAT table is present, we need to convert raw temperature to
real temp using LPAT.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Added Intel Braswell CPU id for SOC DTS. Since this doesn't support
APIC IRQ, the driver is modified to have capability to not register
any modifiable trips.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Up till now, by mistake, wrong variable was tested against being NULL.
Since exynos_report_trigger() is always called with valid p pointer,
it is only necessary to check if a valid thermal zone device is passed.
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Conflicts:
arch/arm/boot/dts/imx6sx-sdb.dts
net/sched/cls_bpf.c
Two simple sets of overlapping changes.
Signed-off-by: David S. Miller <davem@davemloft.net>
After removing exynos_thermal_common.[c|h] files the CONFIG_EXYNOS_THERMA_CORE
is not needed anymore.
This patch removes this entry from Kconfig.
Reported-by: Paul Bolle <pebolle@tiscali.nl>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Data already present in the exynos_tmu_data.c file has been moved to the
appropriate device tree files.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
In general, the kernel should report temperature readings exactly as
reported by the hardware. The cpu / gpu thermal driver works in 5 degree
increments,but we ought to do more accurate. The temperature will do
linear interpolation between the entries in the table.
Test= $md5sum /dev/zero &
$while true; do grep "" /sys/class/thermal/thermal_zone[1-2]/temp;
sleep .5; done
e.g. We can get the result as follows:
/sys/class/thermal/thermal_zone1/temp:39994
/sys/class/thermal/thermal_zone2/temp:39086
/sys/class/thermal/thermal_zone1/temp:39994
/sys/class/thermal/thermal_zone2/temp:39540
/sys/class/thermal/thermal_zone1/temp:39540
/sys/class/thermal/thermal_zone2/temp:39540
/sys/class/thermal/thermal_zone1/temp:39540
/sys/class/thermal/thermal_zone2/temp:39994
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
After defining all necessary Exynos data in the device tree and heavy
reusage of the of-thermal.c those files can be removed.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch brings support for providing configuration via device tree.
Previously this data has been hardcoded in the exynos_tmu_data.c file.
Such approach was not scalable and very often required copying the whole
data.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Up till now exynos_tmu_data.c was used for storing CPU cooling configuration
data. Now the Exynos thermal core code uses device tree to get this data.
For this purpose generic thermal code for configuring CPU cooling was
used.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch is a preparatory patch to be able to read Exynos thermal
configuration from the device tree.
It turned out that DTC is not able to interpret enums properly and hence
it is necessary to #define those values explicitly.
For this reason the ./include/dt-bindings/thermal/thermal_exynos.h file
has been introduced.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Up till now the thermal_zone mode was by default "disabled". With this
patch the default behavior was changed to "enable".
One can read the mode at:
/sys/class/thermal/thermal_zone0/mode
Tested-by: Javi Merino <javi.merino@arm.com>
Reported-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Added thermal zones for processor thermal using APIs provided by
int340x thermal zone module.
Like other INT340x devices, processor thermal device can also contain
trip points and way to get temperature. On some platform there is
no ACPI _TMP method, in those platform using IA64 architecture MSRs to
get temperature.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Using APIs from int340x thermal zone module to add and remove thermal
zones.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Using APIs from int340x thermal zone module to add and remove thermal
zones.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Most of the processing for each int340x driver to add a thermal zone
is very similar and every driver has to duplicate code.
Created a common module, which exports API to add and remove zones.
In this way, we not only avoid duplicate code but also helps in
bug fixes and enhancements.
If for some driver default processing for thermal zone callback is
not enough they can overide individual callback.
The code for this driver is primarily copied from int3402_thermal.c.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Contrary to common expectations for an "int" return, these functions
return only a positive value -- if used correctly they cannot even
return 0 because the message header will necessarily be in the skb.
This makes the very common pattern of
if (genlmsg_end(...) < 0) { ... }
be a whole bunch of dead code. Many places also simply do
return nlmsg_end(...);
and the caller is expected to deal with it.
This also commonly (at least for me) causes errors, because it is very
common to write
if (my_function(...))
/* error condition */
and if my_function() does "return nlmsg_end()" this is of course wrong.
Additionally, there's not a single place in the kernel that actually
needs the message length returned, and if anyone needs it later then
it'll be very easy to just use skb->len there.
Remove this, and make the functions void. This removes a bunch of dead
code as described above. The patch adds lines because I did
- return nlmsg_end(...);
+ nlmsg_end(...);
+ return 0;
I could have preserved all the function's return values by returning
skb->len, but instead I've audited all the places calling the affected
functions and found that none cared. A few places actually compared
the return value with <= 0 in dump functionality, but that could just
be changed to < 0 with no change in behaviour, so I opted for the more
efficient version.
One instance of the error I've made numerous times now is also present
in net/phonet/pn_netlink.c in the route_dumpit() function - it didn't
check for <0 or <=0 and thus broke out of the loop every single time.
I've preserved this since it will (I think) have caused the messages to
userspace to be formatted differently with just a single message for
every SKB returned to userspace. It's possible that this isn't needed
for the tools that actually use this, but I don't even know what they
are so couldn't test that changing this behaviour would be acceptable.
Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Pull thermal fixes from Zhang Rui:
"Specifics:
- bogus type qualifier fix in OF thermal code.
- Minor fixes on imx and rcar thermal drivers.
- Update TI SoC thermal maintainer entry.
- Updated documentation of OF cpufreq cooling register"
* 'thermal-soc' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: rcar: Spelling/grammar: s/drier use .../driver uses ...s/
thermal: rcar: change type of ctemp in rcar_thermal_update_temp()
thermal: rcar: fix ENR register value
Documentation: thermal: document of_cpufreq_cooling_register()
Thermal: imx: add clk disable/enable for suspend/resume
MAINTAINERS: update ti-soc-thermal status
MAINTAINERS: Add linux-omap to list of reviewers for TI Thermal
thermal: of: Remove bogus type qualifier for of_thermal_get_trip_points()
Since the ctemp is used for rcar_thermal_write() in
rcar_thermal_update_temp(), the type of 'ctemp' should be "u32" instead
of "int". This patch also changes type of the helper variables 'old'
and 'new'.
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
On R-Mobile APE6, since it has 3 thermal zones, ENR register
has enable bits in bit 19-16, bit 11-8 and bit 3-0.
However, on R-Car gen2, since it has 1 thermal zone, ENR register has
enable bits in bit 3-0. (In other words, the write value should always
be 0 for bit 31-4 of ENR register.)
So, this patch fixes the ENR register value using I/O resource sets.
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Thermal sensor's clk is from pll3_usb_otg, per hardware
design requirement, need to make sure pll3_usb_otg is disabled
before STOP mode is entered, otherwise, all PFDs under it may
enter incorrect state, this patch disables pll3_usb_otg before
suspend and enables it after resume.
Signed-off-by: Anson Huang <b20788@freescale.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
there is no ACPI device object
processor_thermal_device driver needs ACPI support to work. Thus, the driver
probing should fail when there is no ACPI device object asscociated.
This fixes a NULL pointer dereference when the driver is loaded
with INT340X feature disabled in BIOS.
Reported-by: Chen Yu <yu.c.chen@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Chen Yu <yu.c.chen@intel.com>
