Commit Graph

75 Commits

Author SHA1 Message Date
Guillaume La Roque
421eda108e thermal: amlogic: Add thermal driver to support G12 SoCs
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).

The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.

Implement reading the temperature from each thermal sensor.

The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold

Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
2019-11-07 07:00:26 +01:00
Talel Shenhar
71aa369349 thermal: Introduce Amazon's Annapurna Labs Thermal Driver
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.

This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.

Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14 07:00:26 -07:00
Amit Kucheria
72e9baf997 drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir
This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 16:49:02 +08:00
Amit Kucheria
3e8c4d31f8 drivers: thermal: Move various drivers for intel platforms into a subdir
This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 16:48:47 +08:00
David HERNANDEZ SANCHEZ
1d69315560 thermal: add stm32 thermal driver
Add support for DTS thermal sensor that can be
found on some STM32 platforms.

This driver is based on OF and works in interrupt
mode.

It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.

Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25 10:44:52 -07:00
Linus Torvalds
cf9b0772f2 ARM: SoC driver updates for v4.15
This branch contains platform-related driver updates for ARM and ARM64,
 these are the areas that bring the changes:
 
 New drivers:
  - Driver support for Renesas R-Car V3M (R8A77970)
  - Power management support for Amlogic GX
  - A new driver for the Tegra BPMP thermal sensor
  - A new bus driver for Technologic Systems NBUS
 
 Changes for subsystems that prefer to merge through arm-soc:
  - The usual updates for reset controller drivers from Philipp Zabel,
    with five added drivers for SoCs in the arc, meson, socfpa, uniphier
    and mediatek families.
  - Updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
    Heiner Kallweit and Lorenzo Pieralisi.
 
 Changes specific to some ARM-based SoC
  - The Freescale/NXP DPAA QBMan drivers from PowerPC can now work
    on ARM as well.
  - Several changes for power management on Broadcom SoCs
  - Various improvements on Qualcomm, Broadcom, Amlogic, Atmel, Mediatek
  - Minor Cleanups for Samsung, TI OMAP SoCs
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Merge tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC driver updates from Arnd Bergmann:
 "This branch contains platform-related driver updates for ARM and
  ARM64, these are the areas that bring the changes:

  New drivers:

   - driver support for Renesas R-Car V3M (R8A77970)

   - power management support for Amlogic GX

   - a new driver for the Tegra BPMP thermal sensor

   - a new bus driver for Technologic Systems NBUS

  Changes for subsystems that prefer to merge through arm-soc:

   - the usual updates for reset controller drivers from Philipp Zabel,
     with five added drivers for SoCs in the arc, meson, socfpa,
     uniphier and mediatek families

   - updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
     Heiner Kallweit and Lorenzo Pieralisi

  Changes specific to some ARM-based SoC

   - the Freescale/NXP DPAA QBMan drivers from PowerPC can now work on
     ARM as well

   - several changes for power management on Broadcom SoCs

   - various improvements on Qualcomm, Broadcom, Amlogic, Atmel,
     Mediatek

   - minor Cleanups for Samsung, TI OMAP SoCs"

[ NOTE! This doesn't work without the previous ARM SoC device-tree pull,
  because the R8A77970 driver is missing a header file that came from
  that pull.

  The fact that this got merged afterwards only fixes it at this point,
  and bisection of that driver will fail if/when you walk into the
  history of that driver.           - Linus ]

* tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (96 commits)
  soc: amlogic: meson-gx-pwrc-vpu: fix power-off when powered by bootloader
  bus: add driver for the Technologic Systems NBUS
  memory: omap-gpmc: Remove deprecated gpmc_update_nand_reg()
  soc: qcom: remove unused label
  soc: amlogic: gx pm domain: add PM and OF dependencies
  drivers/firmware: psci_checker: Add missing destroy_timer_on_stack()
  dt-bindings: power: add amlogic meson power domain bindings
  soc: amlogic: add Meson GX VPU Domains driver
  soc: qcom: Remote filesystem memory driver
  dt-binding: soc: qcom: Add binding for rmtfs memory
  of: reserved_mem: Accessor for acquiring reserved_mem
  of/platform: Generalize /reserved-memory handling
  soc: mediatek: pwrap: fix fatal compiler error
  soc: mediatek: pwrap: fix compiler errors
  arm64: mediatek: cleanup message for platform selection
  soc: Allow test-building of MediaTek drivers
  soc: mediatek: place Kconfig for all SoC drivers under menu
  soc: mediatek: pwrap: add support for MT7622 SoC
  soc: mediatek: pwrap: add common way for setup CS timing extenstion
  soc: mediatek: pwrap: add MediaTek MT6380 as one slave of pwrap
  ..
2017-11-16 16:05:01 -08:00
Greg Kroah-Hartman
b24413180f License cleanup: add SPDX GPL-2.0 license identifier to files with no license
Many source files in the tree are missing licensing information, which
makes it harder for compliance tools to determine the correct license.

By default all files without license information are under the default
license of the kernel, which is GPL version 2.

Update the files which contain no license information with the 'GPL-2.0'
SPDX license identifier.  The SPDX identifier is a legally binding
shorthand, which can be used instead of the full boiler plate text.

This patch is based on work done by Thomas Gleixner and Kate Stewart and
Philippe Ombredanne.

How this work was done:

Patches were generated and checked against linux-4.14-rc6 for a subset of
the use cases:
 - file had no licensing information it it.
 - file was a */uapi/* one with no licensing information in it,
 - file was a */uapi/* one with existing licensing information,

Further patches will be generated in subsequent months to fix up cases
where non-standard license headers were used, and references to license
had to be inferred by heuristics based on keywords.

The analysis to determine which SPDX License Identifier to be applied to
a file was done in a spreadsheet of side by side results from of the
output of two independent scanners (ScanCode & Windriver) producing SPDX
tag:value files created by Philippe Ombredanne.  Philippe prepared the
base worksheet, and did an initial spot review of a few 1000 files.

The 4.13 kernel was the starting point of the analysis with 60,537 files
assessed.  Kate Stewart did a file by file comparison of the scanner
results in the spreadsheet to determine which SPDX license identifier(s)
to be applied to the file. She confirmed any determination that was not
immediately clear with lawyers working with the Linux Foundation.

Criteria used to select files for SPDX license identifier tagging was:
 - Files considered eligible had to be source code files.
 - Make and config files were included as candidates if they contained >5
   lines of source
 - File already had some variant of a license header in it (even if <5
   lines).

All documentation files were explicitly excluded.

The following heuristics were used to determine which SPDX license
identifiers to apply.

 - when both scanners couldn't find any license traces, file was
   considered to have no license information in it, and the top level
   COPYING file license applied.

   For non */uapi/* files that summary was:

   SPDX license identifier                            # files
   ---------------------------------------------------|-------
   GPL-2.0                                              11139

   and resulted in the first patch in this series.

   If that file was a */uapi/* path one, it was "GPL-2.0 WITH
   Linux-syscall-note" otherwise it was "GPL-2.0".  Results of that was:

   SPDX license identifier                            # files
   ---------------------------------------------------|-------
   GPL-2.0 WITH Linux-syscall-note                        930

   and resulted in the second patch in this series.

 - if a file had some form of licensing information in it, and was one
   of the */uapi/* ones, it was denoted with the Linux-syscall-note if
   any GPL family license was found in the file or had no licensing in
   it (per prior point).  Results summary:

   SPDX license identifier                            # files
   ---------------------------------------------------|------
   GPL-2.0 WITH Linux-syscall-note                       270
   GPL-2.0+ WITH Linux-syscall-note                      169
   ((GPL-2.0 WITH Linux-syscall-note) OR BSD-2-Clause)    21
   ((GPL-2.0 WITH Linux-syscall-note) OR BSD-3-Clause)    17
   LGPL-2.1+ WITH Linux-syscall-note                      15
   GPL-1.0+ WITH Linux-syscall-note                       14
   ((GPL-2.0+ WITH Linux-syscall-note) OR BSD-3-Clause)    5
   LGPL-2.0+ WITH Linux-syscall-note                       4
   LGPL-2.1 WITH Linux-syscall-note                        3
   ((GPL-2.0 WITH Linux-syscall-note) OR MIT)              3
   ((GPL-2.0 WITH Linux-syscall-note) AND MIT)             1

   and that resulted in the third patch in this series.

 - when the two scanners agreed on the detected license(s), that became
   the concluded license(s).

 - when there was disagreement between the two scanners (one detected a
   license but the other didn't, or they both detected different
   licenses) a manual inspection of the file occurred.

 - In most cases a manual inspection of the information in the file
   resulted in a clear resolution of the license that should apply (and
   which scanner probably needed to revisit its heuristics).

 - When it was not immediately clear, the license identifier was
   confirmed with lawyers working with the Linux Foundation.

 - If there was any question as to the appropriate license identifier,
   the file was flagged for further research and to be revisited later
   in time.

In total, over 70 hours of logged manual review was done on the
spreadsheet to determine the SPDX license identifiers to apply to the
source files by Kate, Philippe, Thomas and, in some cases, confirmation
by lawyers working with the Linux Foundation.

Kate also obtained a third independent scan of the 4.13 code base from
FOSSology, and compared selected files where the other two scanners
disagreed against that SPDX file, to see if there was new insights.  The
Windriver scanner is based on an older version of FOSSology in part, so
they are related.

Thomas did random spot checks in about 500 files from the spreadsheets
for the uapi headers and agreed with SPDX license identifier in the
files he inspected. For the non-uapi files Thomas did random spot checks
in about 15000 files.

In initial set of patches against 4.14-rc6, 3 files were found to have
copy/paste license identifier errors, and have been fixed to reflect the
correct identifier.

Additionally Philippe spent 10 hours this week doing a detailed manual
inspection and review of the 12,461 patched files from the initial patch
version early this week with:
 - a full scancode scan run, collecting the matched texts, detected
   license ids and scores
 - reviewing anything where there was a license detected (about 500+
   files) to ensure that the applied SPDX license was correct
 - reviewing anything where there was no detection but the patch license
   was not GPL-2.0 WITH Linux-syscall-note to ensure that the applied
   SPDX license was correct

This produced a worksheet with 20 files needing minor correction.  This
worksheet was then exported into 3 different .csv files for the
different types of files to be modified.

These .csv files were then reviewed by Greg.  Thomas wrote a script to
parse the csv files and add the proper SPDX tag to the file, in the
format that the file expected.  This script was further refined by Greg
based on the output to detect more types of files automatically and to
distinguish between header and source .c files (which need different
comment types.)  Finally Greg ran the script using the .csv files to
generate the patches.

Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Philippe Ombredanne <pombredanne@nexb.com>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-11-02 11:10:55 +01:00
Mikko Perttunen
7afebede62 thermal: Add Tegra BPMP thermal sensor driver
On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
2017-10-19 16:31:47 +02:00
Kunihiko Hayashi
86da439175 thermal: uniphier: add UniPhier thermal driver
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:49:52 +08:00
Linus Torvalds
6a776e47a0 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Fix a problem where orderly_shutdown() is called for multiple times
   due to multiple critical overheating events raised in a short period
   by platform thermal driver. (Keerthy)

 - Introduce a backup thermal shutdown mechanism, which invokes
   kernel_power_off()/emergency_restart() directly, after
   orderly_shutdown() being issued for certain amount of time(specified
   via Kconfig). This is useful in certain conditions that userspace may
   be unable to power off the system in a clean manner and leaves the
   system in a critical state, like in the middle of driver probing
   phase. (Keerthy)

 - Introduce a new interface in thermal devfreq_cooling code so that the
   driver can provide more precise data regarding actual power to the
   thermal governor every time the power budget is calculated. (Lukasz
   Luba)

 - Introduce BCM 2835 soc thermal driver and northstar thermal driver,
   within a new sub-folder. (Rafał Miłecki)

 - Introduce DA9062/61 thermal driver. (Steve Twiss)

 - Remove non-DT booting on TI-SoC driver. Also add support to fetching
   coefficients from DT. (Keerthy)

 - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)

 - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
   Brian Bian)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  thermal: core: Add a back up thermal shutdown mechanism
  thermal: core: Allow orderly_poweroff to be called only once
  Thermal: Intel SoC DTS: Change interrupt request behavior
  trace: thermal: add another parameter 'power' to the tracing function
  thermal: devfreq_cooling: add new interface for direct power read
  thermal: devfreq_cooling: refactor code and add get_voltage function
  thermal: mt8173: minor mtk_thermal.c cleanups
  thermal: bcm2835: move to the broadcom subdirectory
  thermal: broadcom: ns: specify myself as MODULE_AUTHOR
  thermal: da9062/61: Thermal junction temperature monitoring driver
  Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
  thermal: broadcom: add Northstar thermal driver
  dt-bindings: thermal: add support for Broadcom's Northstar thermal
  thermal: bcm2835: add thermal driver for bcm2835 SoC
  dt-bindings: Add thermal zone to bcm2835-thermal example
  thermal: rcar_gen3_thermal: add suspend and resume support
  thermal: rcar_gen3_thermal: store device match data in private structure
  thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
  thermal: rcar_gen3_thermal: record and check number of TSCs found
  thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
  ...
2017-05-12 11:58:45 -07:00
Rafał Miłecki
6892cf07e7 thermal: bcm2835: move to the broadcom subdirectory
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 08:55:37 -07:00
Steve Twiss
608567aac3 thermal: da9062/61: Thermal junction temperature monitoring driver
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:48:03 -07:00
Rafał Miłecki
a94cb7eeec thermal: broadcom: add Northstar thermal driver
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:45:19 -07:00
Stefan Wahren
bcb7dd9ef2 thermal: bcm2835: add thermal driver for bcm2835 SoC
Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-01 09:30:28 -07:00
Viresh Kumar
19678ffb9f cpufreq: dbx500: Manage cooling device from cpufreq driver
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.

The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.

Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-03-16 00:14:31 +01:00
Baoyou Xie
50fdd36f33 thermal: zx2967: add thermal driver for ZTE's zx2967 family
This patch adds thermal driver for ZTE's zx2967 family.

Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18 16:36:12 -08:00
Wolfram Sang
564e73d283 thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-01-19 20:15:28 -08:00
Eduardo Valentin
cd221c7b63 thermal: core: introduce thermal_helpers.c
Here we have a simple code organization. This patch moves
functions that do not need to handle thermal core internal
data structure to thermal_helpers.c file.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23 10:06:12 +08:00
Eduardo Valentin
a369ee88f7 thermal: core: move thermal_zone sysfs to thermal_sysfs.c
This is a code reorganization, simply to concentrate
the code handling sysfs in a specific file: thermal_sysfs.c.

Right now, moving only the sysfs entries of thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23 10:06:12 +08:00
Zhang Rui
040a3eadf0 Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and 'thermal-tegra-hw-throttle' into next 2016-09-27 14:03:19 +08:00
Laxman Dewangan
ec4664b3fd thermal: max77620: Add thermal driver for reporting junction temp
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Jia Hongtao
43528445f6 thermal: qoriq: Add thermal management support
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rajendra Nayak
9066073c6c thermal: qcom: tsens: Add a skeletal TSENS drivers
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Bin Gao
b474303ffd thermal: add Intel BXT WhiskeyCove PMIC thermal driver
This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.

Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-06 06:55:33 +08:00
Laxman Dewangan
b3aef78f76 thermal: generic-adc: Add ADC based thermal sensor driver
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:31 -07:00
Marc Gonzalez
0b58c08b59 thermal: add temperature sensor support for tango SoC
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:30 -07:00
Wei Ni
a4dff94ffd thermal: tegra: move tegra thermal files into tegra directory
Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:27 -07:00
Sascha Hauer
a92db1c808 thermal: Add Mediatek thermal controller support
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-18 07:20:36 -08:00
Ørjan Eide
a76caf55e5 thermal: Add devfreq cooling
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq.  In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-10-30 10:21:01 -07:00
Tushar Dave
d0a12625d2 thermal: Add Intel PCH thermal driver
This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.

Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-08-04 10:06:08 +08:00
Zhang Rui
111b23cf89 Merge branches 'release' and 'thermal-soc' of .git into next 2015-06-11 12:52:14 +08:00
kongxinwei
9a5238a9c6 thermal: hisilicon: add new hisilicon thermal sensor driver
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-06-03 15:58:52 -07:00
Javi Merino
6b775e870c thermal: introduce the Power Allocator governor
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Ivan T. Ivanov
c610afaa21 thermal: Add QPNP PMIC temperature alarm driver
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Ong, Boon Leong
8c18769396 thermal: intel Quark SoC X1000 DTS thermal driver
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:20:43 +08:00
Srinivas Pandruvada
ee073604db Thermal: Intel SoC: DTS thermal IOSF core
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Caesar Wang
cbac8f6394 thermal: rockchip: add driver for thermal
Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 14:35:07 -04:00
Mikko Perttunen
66fb848051 thermal: Add Tegra SOCTHERM thermal management driver
This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Eduardo Valentin
f9df89d897 thermal: introduce clock cooling device
This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:16 -04:00
Zhang Rui
6ceaf58abe Merge branch 'int340x-thermal' of .git into next 2014-10-17 14:30:58 +08:00
Lan Tianyu
4384b8fe16 Thermal: introduce int3403 thermal driver
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:36 +08:00
Zhang Rui
816cab931f Thermal: introduce int3400 thermal driver
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:09 +08:00
Peter Feuerer
e4dbf98f7f thermal: Added Bang-bang thermal governor
The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device.  It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only.  For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-08-27 15:45:58 +08:00
Lee Jones
60aef7ce45 thermal: sti: Introduce ST Thermal core code
This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.

Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:01:22 +08:00
Srinivas Pandruvada
bc40b5e320 thermal: Intel SoC DTS thermal
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 16:37:24 +08:00
Zhang Rui
201531c277 Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
Srinivas Pandruvada
925c36bb09 Thermal: ACPI INT3403 thermal driver
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 09:42:12 +08:00
Eduardo Valentin
4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Eduardo Valentin
0dd88793aa thermal: hwmon: move hwmon support to single file
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:09:12 -04:00
Zhang Rui
036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00