In this patch, the cpu_cooling code checks for the usability of cpufreq
layer before proceeding with the CPU cooling device registration. The
main reason is: CPU cooling device is not usable if cpufreq cannot
switch frequencies.
Similar checks are spread in thermal drivers. Thus, the advantage now
is to have the check in a single place: cpu cooling device registration.
For this reason, this patch also updates the existing drivers that
depend on CPU cooling to simply propagate the error code of the cpu
cooling registration call. Therefore, in case cpufreq is not ready, the
thermal drivers will still return -EPROBE_DEFER, in an attempt to try
again when cpufreq layer gets ready.
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
imx_get_temp might be called before the sensor clock is prepared
thus resulting in a timeout of the first attempt to read temp:
thermal thermal_zone0: failed to read out thermal zone 0
Happened to me on a Utilite Standard with IMX6 Dual SoC.
Reason is that in imx_thermal_probe thermal_zone_device_register
is called before the sensor clock is prepared.
thermal_zone_device_register however calls
thermal_zone_device_update which eventually calls imx_get_temp.
Fix this by preparing the clock before calling
thermal_zone_device_register.
Signed-off-by: Heiner Kallweit <heiner.kallweit@web.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
thermal driver should be regisetered after cpufreq driver has
been registered and probed. Doing so is to make sure that thermal
driver can get the max cpu cooling states correctly when calling
get_property.
Signed-off-by: Bai Ping <b51503@freescale.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;
The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;
Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.
Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
On latest i.MX6 SOC with thermal calibration data of 0x5A100000,
the critical trip temperature will be an invalid value and
cause system auto shutdown as below log:
thermal thermal_zone0: critical temperature reached(42 C),shutting down
So, with universal formula for thermal sensor, only room
temperature point is calibrated, which means the calibration
data read from fuse only has valid data of bit [31:20], others
are all 0, the critical trip point temperature can NOT depend
on the hot point calibration data, here we set it to 20 C higher
than default passive temperature.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thermal sensor used to need two calibration points which are
in fuse map to get a slope for converting thermal sensor's raw
data to real temperature in degree C. Due to the chip calibration
limitation, hardware team provides an universal formula to get
real temperature from internal thermal sensor raw data:
Slope = 0.4297157 - (0.0015976 * 25C fuse);
Update the formula, as there will be no hot point calibration
data in fuse map from now on.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As per previous changes on thermal framework API,
registering a new thermal zone does not require
a const thermal zone ops.
Thus, this patch removes the flag from imx thermal zone ops.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the module device table declaration so the module can be loaded
automatically at boot time.
Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Fixes regression introduced by:
commit 37713a1e8e
Author: Philipp Zabel <p.zabel@pengutronix.de>
Date: Thu Aug 1 18:33:12 2013 +0200
thermal: imx: implement thermal alarm interrupt handling
The commit 37713a1e8e makes imx thermal sensor always powered up as alarm
function is enabled, but the suspend callback of imx thermal returns
success only if thermal sensor is powered down, so it will always returns
fail hence break system's suspend, this patch disables imx thermal sensor
before suspend and re-enable it after resume.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Enable automatic measurements at 10 Hz and use the alarm interrupt to react
more quickly to sudden temperature changes above the passive or critical
temperature trip points.
Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Set passive and critical trip point values depending on the maximum die
temperature stored in the OCOTP fuses. This allows higher trip points
for industrial and automotive rated i.MX6 SoCs.
Also allow to configure the passive trip point from userspace.
Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.
It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
