Commit Graph

7 Commits

Author SHA1 Message Date
Linus Torvalds
f632a8170a Driver Core and debugfs changes for 5.3-rc1
Here is the "big" driver core and debugfs changes for 5.3-rc1
 
 It's a lot of different patches, all across the tree due to some api
 changes and lots of debugfs cleanups.  Because of this, there is going
 to be some merge issues with your tree at the moment, I'll follow up
 with the expected resolutions to make it easier for you.
 
 Other than the debugfs cleanups, in this set of changes we have:
 	- bus iteration function cleanups (will cause build warnings
 	  with s390 and coresight drivers in your tree)
 	- scripts/get_abi.pl tool to display and parse Documentation/ABI
 	  entries in a simple way
 	- cleanups to Documenatation/ABI/ entries to make them parse
 	  easier due to typos and other minor things
 	- default_attrs use for some ktype users
 	- driver model documentation file conversions to .rst
 	- compressed firmware file loading
 	- deferred probe fixes
 
 All of these have been in linux-next for a while, with a bunch of merge
 issues that Stephen has been patient with me for.  Other than the merge
 issues, functionality is working properly in linux-next :)
 
 Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
 -----BEGIN PGP SIGNATURE-----
 
 iG0EABECAC0WIQT0tgzFv3jCIUoxPcsxR9QN2y37KQUCXSgpnQ8cZ3JlZ0Brcm9h
 aC5jb20ACgkQMUfUDdst+ykcwgCfS30OR4JmwZydWGJ7zK/cHqk+KjsAnjOxjC1K
 LpRyb3zX29oChFaZkc5a
 =XrEZ
 -----END PGP SIGNATURE-----

Merge tag 'driver-core-5.3-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core

Pull driver core and debugfs updates from Greg KH:
 "Here is the "big" driver core and debugfs changes for 5.3-rc1

  It's a lot of different patches, all across the tree due to some api
  changes and lots of debugfs cleanups.

  Other than the debugfs cleanups, in this set of changes we have:

   - bus iteration function cleanups

   - scripts/get_abi.pl tool to display and parse Documentation/ABI
     entries in a simple way

   - cleanups to Documenatation/ABI/ entries to make them parse easier
     due to typos and other minor things

   - default_attrs use for some ktype users

   - driver model documentation file conversions to .rst

   - compressed firmware file loading

   - deferred probe fixes

  All of these have been in linux-next for a while, with a bunch of
  merge issues that Stephen has been patient with me for"

* tag 'driver-core-5.3-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core: (102 commits)
  debugfs: make error message a bit more verbose
  orangefs: fix build warning from debugfs cleanup patch
  ubifs: fix build warning after debugfs cleanup patch
  driver: core: Allow subsystems to continue deferring probe
  drivers: base: cacheinfo: Ensure cpu hotplug work is done before Intel RDT
  arch_topology: Remove error messages on out-of-memory conditions
  lib: notifier-error-inject: no need to check return value of debugfs_create functions
  swiotlb: no need to check return value of debugfs_create functions
  ceph: no need to check return value of debugfs_create functions
  sunrpc: no need to check return value of debugfs_create functions
  ubifs: no need to check return value of debugfs_create functions
  orangefs: no need to check return value of debugfs_create functions
  nfsd: no need to check return value of debugfs_create functions
  lib: 842: no need to check return value of debugfs_create functions
  debugfs: provide pr_fmt() macro
  debugfs: log errors when something goes wrong
  drivers: s390/cio: Fix compilation warning about const qualifiers
  drivers: Add generic helper to match by of_node
  driver_find_device: Unify the match function with class_find_device()
  bus_find_device: Unify the match callback with class_find_device
  ...
2019-07-12 12:24:03 -07:00
Linus Torvalds
222a21d295 Merge branch 'x86-topology-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip
Pull x86 topology updates from Ingo Molnar:
 "Implement multi-die topology support on Intel CPUs and expose the die
  topology to user-space tooling, by Len Brown, Kan Liang and Zhang Rui.

  These changes should have no effect on the kernel's existing
  understanding of topologies, i.e. there should be no behavioral impact
  on cache, NUMA, scheduler, perf and other topologies and overall
  system performance"

* 'x86-topology-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip:
  perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support
  perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support
  hwmon/coretemp: Cosmetic: Rename internal variables to zones from packages
  thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
  perf/x86/intel/cstate: Support multi-die/package
  perf/x86/intel/rapl: Support multi-die/package
  perf/x86/intel/uncore: Support multi-die/package
  topology: Create core_cpus and die_cpus sysfs attributes
  topology: Create package_cpus sysfs attribute
  hwmon/coretemp: Support multi-die/package
  powercap/intel_rapl: Update RAPL domain name and debug messages
  thermal/x86_pkg_temp_thermal: Support multi-die/package
  powercap/intel_rapl: Support multi-die/package
  powercap/intel_rapl: Simplify rapl_find_package()
  x86/topology: Define topology_logical_die_id()
  x86/topology: Define topology_die_id()
  cpu/topology: Export die_id
  x86/topology: Create topology_max_die_per_package()
  x86/topology: Add CPUID.1F multi-die/package support
2019-07-08 18:28:44 -07:00
Greg Kroah-Hartman
72c9f26b58 thermal: intel: no need to check return value of debugfs_create functions
When calling debugfs functions, there is no need to ever check the
return value.  The function can work or not, but the code logic should
never do something different based on this.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-06-18 13:40:25 +02:00
Thomas Gleixner
f6cc69f1f3 treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 309
Based on 2 normalized pattern(s):

  it and or modify it under the terms of the gnu general public
  license version 2 as published by the free software foundation this
  program is distributed in the hope it will be useful but without any
  warranty without even the implied warranty of merchantability or
  fitness for a particular purpose see the gnu general public license
  for more details you should have received a copy of the gnu general
  public license along with this program

  this program is free software you can redistribute it and or modify
  it under the terms and conditions of the gnu general public license
  version 2 as published by the free software foundation this program
  is distributed in the hope it will be useful but without any
  warranty without even the implied warranty of merchantability or
  fitness for a particular purpose see the gnu general public license
  for more details you should have received a copy of the gnu general
  public license along with this program

extracted by the scancode license scanner the SPDX license identifier

  GPL-2.0-only

has been chosen to replace the boilerplate/reference in 11 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000434.249870634@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-06-05 17:37:04 +02:00
Len Brown
b2ce1c883d thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
Syntax update only -- no logical or functional change.

In response to the new multi-die/package changes, update variable names to
use the more generic thermal "zone" terminology, instead of "package", as
the zones can refer to either packages or die.

Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com
2019-05-23 10:08:36 +02:00
Zhang Rui
724adec33c thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
2019-05-23 10:08:33 +02:00
Amit Kucheria
3e8c4d31f8 drivers: thermal: Move various drivers for intel platforms into a subdir
This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 16:48:47 +08:00