This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.
It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.
The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.
An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.
With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.
There is no functional changes.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
When do randbuiding, we got this:
WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR
Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n]
Selected by [y]:
- THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && <choice>
The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the
THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL
which is not enabled.
Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR
to fix this warning.
Suggested-by: Quentin Perret <qperret@google.com>
Fixes: a4e893e802 ("thermal: cpu_cooling: Migrate to using the EM framework")
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com
The newly introduced Energy Model framework manages power cost tables in
a generic way. Moreover, it supports several types of models since the
tables can come from DT or firmware (through SCMI) for example. On the
other hand, the cpu_cooling subsystem manages its own power cost tables
using only DT data.
In order to avoid the duplication of data in the kernel, and in order to
enable IPA with EMs coming from more than just DT, remove the private
tables from cpu_cooling.c and migrate it to using the centralized EM
framework. Doing so should have no visible functional impact for
existing users of IPA since:
- recent extenstions to the the PM_OPP infrastructure enable the
registration of EMs in PM_EM using the DT property used by IPA;
- the existing upstream cpufreq drivers marked with the
'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP
infrastructure, which means they all support PM_EM. The only two
exceptions are qoriq-cpufreq which doesn't in fact use an EM and
scmi-cpufreq which doesn't use DT for power costs.
For existing users of cpu_cooling, PM_EM tables will contain the exact
same power values that IPA used to compute on its own until now. The
only new dependency for them is to compile in CONFIG_ENERGY_MODEL.
The case where the thermal subsystem is used without an Energy Model
(cpufreq_cooling_ops) is handled by looking directly at CPUFreq's
frequency table which is already a dependency for cpu_cooling.c anyway.
Since the thermal framework expects the cooling states in a particular
order, bail out whenever the CPUFreq table is unsorted, since that is
fairly uncommon in general, and there are currently no users of
cpu_cooling for this use-case.
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Quentin Perret <qperret@google.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).
The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.
Implement reading the temperature from each thermal sensor.
The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.
Move over to a device-tree only approach, as we fixed up
the device trees.
Cc: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Pull thermal management updates from Zhang Rui:
- Remove the 'module' Kconfig option for thermal subsystem framework
because the thermal framework are required to be ready as early as
possible to avoid overheat at boot time (Daniel Lezcano)
- Fix a bug that thermal framework pokes disabled thermal zones upon
resume (Wei Wang)
- A couple of cleanups and trivial fixes on int340x thermal drivers
(Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
drivers: thermal: processor_thermal: Downgrade error message
mlxsw: Remove obsolete dependency on THERMAL=m
hwmon/drivers/core: Simplify complex dependency
thermal/drivers/core: Fix typo in the option name
thermal/drivers/core: Remove depends on THERMAL in Kconfig
thermal/drivers/core: Remove module unload code
thermal/drivers/core: Remove the module Kconfig's option
thermal: core: skip update disabled thermal zones after suspend
thermal: make device_register's type argument const
thermal: intel: int340x: processor_thermal_device: simplify to get driver data
thermal/int3403_thermal: favor _TMP instead of PTYP
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/thermal/thermal_mmio.o:
In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1):
undefined reference to `devm_ioremap_resource'
The users of devm_ioremap_resource() which are compile-testable
should depend on HAS_IOMEM.
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Talel Shenhar <talel@amazon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.
This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.
Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Unlike the other options, the cpu cooling option is beginning
with a lowercase letter, changing to a uppercase.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The dependency on the THERMAL option to be set is already there implicitly
by the "if THERMAL" conditionnal option. The sub Kconfigs do not have to
check against the THERMAL option as they are called from a Kconfig block
which is enabled by the conditionnal option.
Remove the useless "depends on THERMAL" in the Kconfigs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The module support for the thermal subsystem makes little sense:
- some subsystems relying on it are not modules, thus forcing the
framework to be compiled in
- it is compiled in for almost every configs, the remaining ones
are a few platforms where I don't see why we can not switch the thermal
to 'y'. The drivers can stay in tristate.
- platforms need the thermal to be ready as soon as possible at boot time
in order to mitigate
Usually the subsystems framework are compiled-in and the plugs are as
module.
Remove the module option. The removal of the module related dead code will
come after this patch gets in or is acked.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <groeck@chromium.org>
For mini2440:
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Paul Burton <paul.burton@mips.com> # MIPS part
Acked-by: Robert Jarzmik <robert.jarzmik@free.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal soc updates from Eduardo Valentin:
"Specifics:
- mediatek thermal now supports MT8183
- broadcom thermal now supports Stingray
- qoirq now supports multiple sensors
- fixes on different drivers: rcar, tsens, tegra
Some new drivers are still pending further review and I chose to leave
them for the next merge window while still sending this material"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal:
thermal: rcar_gen3_thermal: Register hwmon sysfs interface
thermal/qcom/tsens-common : fix possible object reference leak
thermal: tegra: add get_trend ops
thermal: tegra: fix memory allocation
thermal: tegra: remove unnecessary warnings
thermal: mediatek: add support for MT8183
dt-bindings: thermal: add binding document for mt8183 thermal controller
thermal: mediatek: add flag for bank selection
thermal: mediatek: add thermal controller offset
thermal: mediatek: add calibration item
thermal: mediatek: add common index of vts settings.
thermal: mediatek: fix register index error
thermal: qoriq: add multiple sensors support
thermal: broadcom: Add Stingray thermal driver
dt-bindings: thermal: Add binding document for SR thermal
Stingray SoC has six temperature sensor and those are
configured, controlled and accessed to read temperature
and update in DDR memory using m0 firmware.
All six sensors has been given 4 bytes of memory in DDR
to write temperature in millivolts.
This thermal driver read temperature values from DDR
because no direct access to sensors.
Like this all temparature sensors are monitored and
trips at critical temperature.
If driver can't handle thermal runaways because of
any unknown reason, then firmware in m0 Processor
will handle.
Reviewed-by: Ray Jui <ray.jui@broadcom.com>
Reviewed-by: Scott Branden <scott.branden@broadcom.com>
Reviewed-by: Vikram Prakash <vikram.prakash@broadcom.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Pramod Kumar <pramod.kumar@broadcom.com>
Signed-off-by: Srinath Mannam <srinath.mannam@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The CPU cooling driver (cpu_cooling.c) allows the platform's cpufreq
driver to register as a cooling device and cool down the platform by
throttling the CPU frequency. In order to be able to auto-register a
cpufreq driver as a cooling device from the cpufreq core, we need access
to code inside cpu_cooling.c which, in turn, accesses code inside
thermal core.
CPU_FREQ is a bool while THERMAL is tristate. In some configurations
(e.g. allmodconfig), CONFIG_THERMAL ends up as a module while
CONFIG_CPU_FREQ is compiled in. This leads to following error:
drivers/cpufreq/cpufreq.o: In function `cpufreq_offline':
cpufreq.c:(.text+0x407c): undefined reference to `cpufreq_cooling_unregister'
drivers/cpufreq/cpufreq.o: In function `cpufreq_online':
cpufreq.c:(.text+0x70c0): undefined reference to `of_cpufreq_cooling_register'
Given that platforms using CPU_THERMAL usually want it compiled-in so it
is available early in boot, make CPU_THERMAL depend on THERMAL being
compiled-in instead of allowing it to be a module.
As a result of this change, get rid of the ugly (!CPU_THERMAL ||
THERMAL) dependency in all cpufreq drivers using CPU_THERMAL.
Suggested-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Pull thermal management updates from Zhang Rui:
- Add locking for cooling device sysfs attribute in case the cooling
device state is changed by userspace and thermal framework
simultaneously. (Thara Gopinath)
- Fix a problem that passive cooling is reset improperly after system
suspend/resume. (Wei Wang)
- Cleanup the driver/thermal/ directory by moving intel and qcom
platform specific drivers to platform specific sub-directories. (Amit
Kucheria)
- Some trivial cleanups. (Lukasz Luba, Wolfram Sang)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal/intel: fixup for Kconfig string parsing tightening up
drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir
drivers: thermal: Move various drivers for intel platforms into a subdir
thermal: Fix locking in cooling device sysfs update cur_state
Thermal: do not clear passive state during system sleep
thermal: zx2967_thermal: simplify getting .driver_data
thermal: st: st_thermal: simplify getting .driver_data
thermal: spear_thermal: simplify getting .driver_data
thermal: rockchip_thermal: simplify getting .driver_data
thermal: int340x_thermal: int3400_thermal: simplify getting .driver_data
thermal: remove unused function parameter
Pull thermal SoC updates from Eduardo Valentin:
- Tegra DT binding documentation for Tegra194
- Armada now supports ap806 and cp110
- RCAR thermal now supports R8A774C0 and R8A77990
- Fixes on thermal_hwmon, IMX, generic-ADC, ST, RCAR, Broadcom,
Uniphier, QCOM, Tegra, PowerClamp, and Armada thermal drivers.
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (22 commits)
thermal: generic-adc: Fix adc to temp interpolation
thermal: rcar_thermal: add R8A77990 support
dt-bindings: thermal: rcar-thermal: add R8A77990 support
thermal: rcar_thermal: add R8A774C0 support
dt-bindings: thermal: rcar-thermal: add R8A774C0 support
dt-bindings: cp110: document the thermal interrupt capabilities
dt-bindings: ap806: document the thermal interrupt capabilities
MAINTAINERS: thermal: add entry for Marvell MVEBU thermal driver
thermal: armada: add overheat interrupt support
thermal: st: fix Makefile typo
thermal: uniphier: Convert to SPDX identifier
thermal/intel_powerclamp: Change to use DEFINE_SHOW_ATTRIBUTE macro
thermal: tegra: soctherm: Change to use DEFINE_SHOW_ATTRIBUTE macro
dt-bindings: thermal: tegra-bpmp: Add Tegra194 support
thermal: imx: save one condition block for normal case of nvmem initialization
thermal: imx: fix for dependency on cpu-freq
thermal: tsens: qcom: do not create duplicate regmap debugfs entries
thermal: armada: Use PTR_ERR_OR_ZERO in armada_thermal_probe_legacy()
dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interrupts
thermal: broadcom: use devm_thermal_zone_of_sensor_register
...
The thermal driver is a standalone driver for monitoring SoC temperature
by enabling thermal sensor, so it can be enabled even when CONFIG_CPU_FREQ
is NOT set. So remove the dependency with CPU_THERMAL.
Introduce dummy function of legacy cooling register/unregister to make
thermal driver probe successfully when CONFIG_CPU_FREQ is NOT set.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Kconfig lexer supports special characters such as '.' and '/' in
the parameter context. In my understanding, the reason is just to
support bare file paths in the source statement.
I do not see a good reason to complicate Kconfig for the room of
ambiguity.
The majority of code already surrounds file paths with double quotes,
and it makes sense since file paths are constant string literals.
Make it treewide consistent now.
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
Acked-by: Wolfram Sang <wsa@the-dreams.de>
Acked-by: Geert Uytterhoeven <geert@linux-m68k.org>
Acked-by: Ingo Molnar <mingo@kernel.org>
This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal SoC updates from Eduardo Valentin:
"Several new things coming up. Specifics:
- Rework of tsens and hisi thermal drivers
- OF-thermal now allows sharing multiple cooling devices on maps
- Added support for r8a7744 and R8A77970 on rcar thermal driver
- Added support for r8a774a1 on rcar_gen3 thermal driver
- New thermal driver stm32
- Fixes on multiple thermal drivers: of-thermal, imx, qoriq, armada,
qcom-spmi, rcar, da9062/61"
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (41 commits)
thermal: da9062/61: Prevent hardware access during system suspend
thermal: rcar_thermal: Prevent doing work after unbind
thermal: rcar_thermal: Prevent hardware access during system suspend
thermal: rcar_gen3_thermal: add R8A77980 support
dt-bindings: thermal: rcar-gen3-thermal: document R8A77980 bindings
thermal: add stm32 thermal driver
dt-bindings: stm32-thermal: add binding documentation
thermal: rcar_thermal: add R8A77970 support
dt-bindings: thermal: rcar-thermal: document R8A77970 bindings
thermal: rcar_thermal: fix duplicate IRQ request
dt-bindings: thermal: rcar: Add device tree support for r8a7744
thermal/drivers/hisi: Add the dual clusters sensors for hi3660
thermal/drivers/hisi: Add more sensors channel
thermal/drivers/hisi: Remove pointless irq field
thermal/drivers/hisi: Use platform_get_irq_byname
thermal/drivers/hisi: Replace macro name with relevant sensor location
thermal/drivers/hisi: Add multiple sensors support
thermal/drivers/hisi: Prepare to support multiple sensors
thermal/drivers/hisi: Factor out the probe functions
thermal/drivers/hisi: Set the thermal zone private data to the sensor pointer
...
Add support for DTS thermal sensor that can be
found on some STM32 platforms.
This driver is based on OF and works in interrupt
mode.
It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Intel SoC DTS uses a hardcoded GSI number, before this commit
it was passing it to request_irq as if it were a linux irq number,
but there is no 1:1 mapping so in essence it was requesting a
random interrupt.
Besides this causing the DTS driver to not actually get an interrupt
if the thermal thresholds are exceeded this also is causing an
interrupt conflict on some devices since the linux irq 86 which is
being requested is already in use, leading to oopses like this:
genirq: Flags mismatch irq 86. 00002001 (soc_dts) vs. 00000083 (volume_down)
CPU: 0 PID: 601 Comm: systemd-udevd Tainted: G C OE 4.17.0-rc6+ #45
Hardware name: Insyde i86/Type2 - Board Product Name, BIOS CHUWI.D86JLBNR03 01/14/2015
Call Trace:
dump_stack+0x5c/0x80
__setup_irq.cold.50+0x4e/0xac
? request_threaded_irq+0xad/0x160
request_threaded_irq+0xf5/0x160
? 0xffffffffc0a93000
intel_soc_thermal_init+0x74/0x1000 [intel_soc_dts_thermal]
This commit makes the intel_soc_dts_thermal.c code call
acpi_register_gsi() to translate the hardcoded IO-APIC GSI number (86)
to a linux irq, so that the dts code uses the right interrupt and we
no longer get an oops about an irq conflict.
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.
The write-only "reset" file is used to reset the statistics.
The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.
The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.
The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.
This is how the directory structure looks like for a single cooling
device:
$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent
/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status
/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table
This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Update Armada thermal driver Kconfig entry as well as the driver's
MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported,
eg. Armada 7K and Armada 8K.
Use the generic term "Marvell EBU Armada SoCs" instead of listing all
the supported SoCs everywhere (excepted in the Kconfig description,
where it is useful to have a list).
Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The AVS TMON core provides temperature readings, a pair of configurable
high- and low-temperature threshold interrupts, and an emergency
over-temperature chip reset. The driver utilizes the first two to
provide temperature readings and high-temperature notifications to
applications. The over-temperature reset is not exposed to
applications; this reset threshold is critical to the system and should
be set with care within the bootloader.
Applications may choose to utilize the notification mechanism, the
temperature reading mechanism (e.g., through polling), or both.
Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Doug Berger <opendmb@gmail.com>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Moving the bcm2835 thermal driver to the broadcom directory prevented it
from getting enabled for arm64 builds, since the broadcom directory is only
available when 32-bit specific ARCH_BCM is set.
Fix this by enabling the Broadcom menu for ARCH_BCM or ARCH_BCM2835.
Fixes: 6892cf07e7 ("thermal: bcm2835: move to the broadcom subdirectory")
Reviewed-by: Eric Anholt <eric@anholt.net>
Signed-off-by: Allen Wild <allenwild93@gmail.com>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:
drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.
Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:
warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)
This adds a new depedency.
Fixes: 3a2419f865 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Fix a problem where orderly_shutdown() is called for multiple times
due to multiple critical overheating events raised in a short period
by platform thermal driver. (Keerthy)
- Introduce a backup thermal shutdown mechanism, which invokes
kernel_power_off()/emergency_restart() directly, after
orderly_shutdown() being issued for certain amount of time(specified
via Kconfig). This is useful in certain conditions that userspace may
be unable to power off the system in a clean manner and leaves the
system in a critical state, like in the middle of driver probing
phase. (Keerthy)
- Introduce a new interface in thermal devfreq_cooling code so that the
driver can provide more precise data regarding actual power to the
thermal governor every time the power budget is calculated. (Lukasz
Luba)
- Introduce BCM 2835 soc thermal driver and northstar thermal driver,
within a new sub-folder. (Rafał Miłecki)
- Introduce DA9062/61 thermal driver. (Steve Twiss)
- Remove non-DT booting on TI-SoC driver. Also add support to fetching
coefficients from DT. (Keerthy)
- Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)
- Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
Brian Bian)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: core: Add a back up thermal shutdown mechanism
thermal: core: Allow orderly_poweroff to be called only once
Thermal: Intel SoC DTS: Change interrupt request behavior
trace: thermal: add another parameter 'power' to the tracing function
thermal: devfreq_cooling: add new interface for direct power read
thermal: devfreq_cooling: refactor code and add get_voltage function
thermal: mt8173: minor mtk_thermal.c cleanups
thermal: bcm2835: move to the broadcom subdirectory
thermal: broadcom: ns: specify myself as MODULE_AUTHOR
thermal: da9062/61: Thermal junction temperature monitoring driver
Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
thermal: broadcom: add Northstar thermal driver
dt-bindings: thermal: add support for Broadcom's Northstar thermal
thermal: bcm2835: add thermal driver for bcm2835 SoC
dt-bindings: Add thermal zone to bcm2835-thermal example
thermal: rcar_gen3_thermal: add suspend and resume support
thermal: rcar_gen3_thermal: store device match data in private structure
thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
thermal: rcar_gen3_thermal: record and check number of TSCs found
thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
...
orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).
However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.
Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.
Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.
Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.
(*) It looks like the configuration was never tested with
INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.
If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.
The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).
This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.
When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.
This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add basic thermal driver for bcm2835 SoC.
This driver currently make sure that tsense HW block is set up
correctly.
Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.
The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.
Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal driver is standalone driver which is used to enable
thermal sensors, so it can be used with any cooling device and
should not bind with CPU cooling device driver.
This original patch is suggested by Amit Kucheria; so it's to
polish the dependency in Kconfig, and remove the dependency with
CPU_THERMAL.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
