Currently we support only platform data for specifying the interconnect
endpoints. As now the endpoints are hard-coded into the consumer driver
this may lead to complications when a single driver is used by multiple
SoCs, which may have different interconnect topology.
To avoid cluttering the consumer drivers, introduce a translation function
to help us get the board specific interconnect data from device-tree.
Reviewed-by: Evan Green <evgreen@chromium.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
This patch introduces a new API to get requirements and configure the
interconnect buses across the entire chipset to fit with the current
demand.
The API is using a consumer/provider-based model, where the providers are
the interconnect buses and the consumers could be various drivers.
The consumers request interconnect resources (path) between endpoints and
set the desired constraints on this data flow path. The providers receive
requests from consumers and aggregate these requests for all master-slave
pairs on that path. Then the providers configure each node along the path
to support a bandwidth that satisfies all bandwidth requests that cross
through that node. The topology could be complicated and multi-tiered and
is SoC specific.
Reviewed-by: Evan Green <evgreen@chromium.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
