It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace. Export them to the thermal_zone sysfs so that they can be
easily changed.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed. Export them to sysfs.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).
This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.
This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.
In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.
Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.
Build them into one module in this patch.
This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.
This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.
This way, the messages will always be bound to a thermal zone.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds documentation for thermal_bind_params
and thermal_zone_params structures. Also, adds details
on EXPORT_SYMBOL APIs.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
With commit 6503e5df08,
the value of /sys/class/thermal/thermal_zoneX/mode has been changed
from user/kernel to enabled/disabled.
Update the documentation so that users won't be confused.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.
This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.
Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Values below 1000 milli-celsius don't make sense and can cause the
system to go into a thermal heart attack: the actual temperature
will always be lower and thus the system will be throttled down to
its lowest setting.
An additional problem is that values below 1000 will show as 0 in
/proc/acpi/thermal/TZx/trip_points:passive.
cat passive
0
echo -n 90 >passive
bash: echo: write error: Invalid argument
echo -n 90000 >passive
cat passive
90000
Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
The document currently uses large indentations which make the text
too wide for easy readability. Also improve general consistency.
Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Update the documentation for the thermal driver hwmon sys I/F.
Change the ACPI thermal zone type to be consistent with hwmon.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
The Generic Thermal sysfs driver for thermal management.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
