As usual, this is where the bulk of our changes end up landing each
merge window.
The individual updates are too many to enumerate, many many platforms
have seen additions of device descriptions such that they are
functionally more complete (in fact, this is often the bulk of updates
we see).
Instead I've mostly focused on highlighting the new platforms below as
they are introduced. Sometimes the introduction is of mostly a fragment,
that later gets filled in on later releases, and in some cases it's
near-complete platform support. The latter is more common for derivative
platforms that already has similar support in-tree.
Two SoCs are slight outliers from the usual range of additions. Allwinner
support for F1C100s, a quite old SoC (ARMv5-based) shipping in the
Lychee Pi Nano platform. At the other end is NXP Layerscape LX2160A,
a 16-core 2.2GHz Cortex-A72 SoC with a large amount of I/O aimed at
infrastructure/networking.
TI updates stick out in the diff stats too, in particular because they
have moved the description of their L4 on-chip interconnect to devicetree,
which opens up for removal of even more of their platform-specific
'hwmod' description tables over the next few releases.
SoCs:
- Qualcomm QCS404 (4x Cortex-A53)
- Allwinner T3 (rebranded R40) and f1c100s (armv5)
- NXP i.MX7ULP (1x Cortex-A7 + 1x Cortex-M4)
- NXP LS1028A (2x Cortex-A72), LX2160A (16x Cortex-A72)
New platforms:
- Rockchip: Gru Scarlet (RK3188 Tablet)
- Amlogic: Phicomm N1 (S905D), Libretech S805-AC
- Broadcom: Linksys EA6500 v2 Wi-Fi router (BCM4708)
- Qualcomm: QCS404 base platform and EVB
- Qualcomm: Remove of Arrow SD600
- PXA: First PXA3xx DT board: Raumfeld
- Aspeed: Facebook Backpack-CMM BMC
- Renesas iWave G20D-Q7 (RZ/G1N)
- Allwinner t3-cqa3t-bv3 (T3/R40) and Lichee Pi Nano (F1C100s)
- Allwinner Emlid Neutis N5, Mapleboard MP130
- Marvell Macchiatobin Single Shot (Armada 8040, no 10GbE)
- i.MX: mtrion emCON-MX6, imx6ul-pico-pi, imx7d-sdb-reva
- VF610: Liebherr's BK4 device, ZII SCU4 AIB board
- i.MX7D PICO Hobbit baseboard
- i.MX7ULP EVK board
- NXP LX2160AQDS and LX2160ARDB boards
Other:
- Coresight binding updates across the board
- CPU cooling maps updates across the board
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Merge tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM Device-tree updates from Olof Johansson:
"As usual, this is where the bulk of our changes end up landing each
merge window.
The individual updates are too many to enumerate, many many platforms
have seen additions of device descriptions such that they are
functionally more complete (in fact, this is often the bulk of updates
we see).
Instead I've mostly focused on highlighting the new platforms below as
they are introduced. Sometimes the introduction is of mostly a
fragment, that later gets filled in on later releases, and in some
cases it's near-complete platform support. The latter is more common
for derivative platforms that already has similar support in-tree.
Two SoCs are slight outliers from the usual range of additions.
Allwinner support for F1C100s, a quite old SoC (ARMv5-based) shipping
in the Lychee Pi Nano platform. At the other end is NXP Layerscape
LX2160A, a 16-core 2.2GHz Cortex-A72 SoC with a large amount of I/O
aimed at infrastructure/networking.
TI updates stick out in the diff stats too, in particular because they
have moved the description of their L4 on-chip interconnect to
devicetree, which opens up for removal of even more of their
platform-specific 'hwmod' description tables over the next few
releases.
SoCs:
- Qualcomm QCS404 (4x Cortex-A53)
- Allwinner T3 (rebranded R40) and f1c100s (armv5)
- NXP i.MX7ULP (1x Cortex-A7 + 1x Cortex-M4)
- NXP LS1028A (2x Cortex-A72), LX2160A (16x Cortex-A72)
New platforms:
- Rockchip: Gru Scarlet (RK3188 Tablet)
- Amlogic: Phicomm N1 (S905D), Libretech S805-AC
- Broadcom: Linksys EA6500 v2 Wi-Fi router (BCM4708)
- Qualcomm: QCS404 base platform and EVB
- Qualcomm: Remove of Arrow SD600
- PXA: First PXA3xx DT board: Raumfeld
- Aspeed: Facebook Backpack-CMM BMC
- Renesas iWave G20D-Q7 (RZ/G1N)
- Allwinner t3-cqa3t-bv3 (T3/R40) and Lichee Pi Nano (F1C100s)
- Allwinner Emlid Neutis N5, Mapleboard MP130
- Marvell Macchiatobin Single Shot (Armada 8040, no 10GbE)
- i.MX: mtrion emCON-MX6, imx6ul-pico-pi, imx7d-sdb-reva
- VF610: Liebherr's BK4 device, ZII SCU4 AIB board
- i.MX7D PICO Hobbit baseboard
- i.MX7ULP EVK board
- NXP LX2160AQDS and LX2160ARDB boards
Other:
- Coresight binding updates across the board
- CPU cooling maps updates across the board"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (648 commits)
ARM: dts: suniv: Fix improper bindings include patch
ARM: dts: sunxi: Enable Broadcom-based Bluetooth for multiple boards
arm64: dts: allwinner: a64: bananapi-m64: Add Bluetooth device node
ARM: dts: suniv: Fix improper bindings include patch
arm64: dts: Add spi-[tx/rx]-bus-width for the FSL QSPI controller
arm64: dts: Remove unused properties from FSL QSPI driver nodes
ARM: dts: Add spi-[tx/rx]-bus-width for the FSL QSPI controller
ARM: dts: imx6sx-sdb: Fix the reg properties for the FSL QSPI nodes
ARM: dts: Remove unused properties from FSL QSPI driver nodes
arm64: dts: ti: k3-am654: Enable main domain McSPI0
arm64: dts: ti: k3-am654: Add McSPI DT nodes
arm64: dts: ti: k3-am654: Populate power-domain property for UART nodes
arm64: dts: ti: k3-am654-base-board: Enable ECAP PWM
arm64: dts: ti: k3-am65-main: Add ECAP PWM node
arm64: dts: ti: k3-am654-base-board: Add I2C nodes
arm64: dts: ti: am654-base-board: Add pinmux for main uart0
arm64: dts: ti: k3-am65: Add pinctrl regions
dt-bindings: pinctrl: k3: Introduce pinmux definitions
ARM: dts: exynos: Specify I2S assigned clocks in proper node
ARM: dts: exynos: Add missing CPUs in cooling maps for Odroid X2
...
Add the backlight device for the LVDS1 output, in preparation for panel
support.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
While commit 3b7e7848f0 ("arm64: dts: renesas: r8a7795: Add IPMMU
device nodes") for R-Car H3 ES2.0 did include power-domains properties,
they were forgotten in the counterpart for older R-Car H3 ES1.x SoCs.
Fixes: e4b9a493df ("arm64: dts: renesas: r8a7795-es1: Add IPMMU device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The R-Car Gen3 HardWare Manual Errata for Rev. 1.00 (Aug 24, 2018)
removed the IPMMU-IR IOMMU instance on R-Car M3-N, as this SoC does not
have an Image Processing Unit (IMP-X5) nor the A3IR power domain.
Fixes: 55697cbb44 ("arm64: dts: renesas: r8a779{65,80,90}: Add IPMMU devices nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the thermal device node and the thermal-zone for
the R8A77990 SoC.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds I2C-DVFS device node for the R8A77990 SoC.
v2
* Drop aliases update as in upstream it is not required to configure the
BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired.
* Do not describe the device as compatible with "renesas,rcar-gen3-iic" or
"renesas,rmobile-iic" fallback compat strings. The absence of automatic
transmission registers leads us to declare the r8a77990 IIC controller as
incompatible.
v2.1
* Reduced register range to reflect documentation
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC
and enables CANFD connected to CN10 on the E3 Ebisu board using the
R8A77990 SoC.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds CAN{0,1} and CANFD controller nodes for the R8A77965 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds PCI express channel 0 device node to the R8A77990 SoC
and enables PCIEC0 PCI express controller on the Ebisu board.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Set the capacity-dmips-mhz for R-Car Gen3 SoCs, that is based on
dhrystone. The average in 10 times of dhrystone result as follows:
r8a7795 SoC (A57x4 + A53x4)
CPU max-freq dhrystone
---------------------------------
A57 1500 MHz 11470943 lps/s
A53 1200 MHz 4798583 lps/s
r8a7796 SoC (A57x2 + A53x4)
CPU max-freq dhrystone
---------------------------------
A57 1500 MHz 11463526 lps/s
A53 1200 MHz 4793276 lps/s
Based on above, capacity-dmips-mhz values are calculated as follows:
r8a7795 SoC
A57 : 1024 / (11470943 / 1500) * (11470943 / 1500) = 1024
A53 : 1024 / (11470943 / 1500) * ( 4798583 / 1200) = 535
r8a7796 SoC
A57 : 1024 / (11463526 / 1500) * (11463526 / 1500) = 1024
A53 : 1024 / (11463526 / 1500) * ( 4793276 / 1200) = 535
However, since each CPUs have different max frequencies, the final
CPU capacities of A53 are scaled by this difference, the values are
as follows.
[r8a7795 SoC]
$ cat /sys/devices/system/cpu/cpu*/cpu_capacity
1024 <---- CPU capacity of A57
1024
1024
1024
428 <---- CPU capacity of A53
428
428
428
[r8a7796 SoC]
$ cat /sys/devices/system/cpu/cpu*/cpu_capacity
1024 <---- CPU capacity of A57
1024
428 <---- CPU capacity of A53
428
428
428
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the "cpu-map" into r8a7795/r8a7796 composed of
multi-cluster. This definition is used to parse the cpu topology.
Signed-off-by: Gaku Inami <gaku.inami.xh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Now that include/dt-bindings/clock/r8a774a1-cpg-mssr.h is in Linus'
master branch we can replace clock related magic numbers with the
corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
[simon: corrected whitespace]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Now that include/dt-bindings/power/r8a774a1-sysc.h is in Linus'
master branch we can replace power related magic numbers with
the corresponding labels.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
rsnd driver supports SSIU now, let's use it.
Then, BUSIF DMA settings on rcar_sound,ssi (= rxu, txu) are
no longer needed.
To avoid git merge timing issue / git bisect issue,
this patch doesn't remove it so far, but will be removed in
the future.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The VIN driver bindings dictates fixed numbering for VIN endpoints connected
to CSI-2 endpoints, even when a single endpoint exists.
Without proper endpoint numbering the VIN driver fails to probe.
Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Fixes: ec70407ae7 ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: Koji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC
and enables SD card slot connected to SDHI0, micro SD card slot
connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board
using the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Simon Horman <horms+renesas@verge.net.au>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Cc: linux-renesas-soc@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds pin control for SCIF2 on R8A77990 E3 Ebisu.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The eMMC card has two supplies, VCC and VCCQ. The VCC supplies the NAND
array and the VCCQ supplies the bus. On Salvator-X and ULCB, the VCC is
connected to 3.3V rail, while the VCCQ is connected to 1.8V rail. Adjust
the pinmux to match the bus, which is always operating in 1.8V mode.
While at it, deduplicate the pinmux entries, which are now the same for
both default and UHS modes. We still need the two pinctrl entries to
match the bindings though.
Signed-off-by: Marek Vasut <marek.vasut+renesas@gmail.com>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the device nodes for all HSCIF serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe TMUs in the R8A779{7|8}0 device trees.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch enables Audio for the Ebisu board on R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: rebased]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds Audio-DMAC0 device node and Sound device node
for the R8A77990 SoC.
Based on work by Takeshi Kihara and Hai Nguyen Pham.
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
[simon: dropped include update, which is already present]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards.
R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds
a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side,
this patch adds vbus0_usb2 node on r8a77990-ebisu.dts.
R-Car D3 Draak board doesn't connect the ID pin, so this adds
"renesas,no-otg-pins" property into usb2_phy0 node.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds a property "companion" with xhci0 phandle to
the usb3_peri0 node in salvator-common.dtsi.
About the detail of this property for renesas_usb3 udc driver, please
refer to the commit 39facfa01c ("usb: gadget: udc: renesas_usb3:
Add register of usb role switch").
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the R-Car V3H AVB device to IPMMU-DS1 33 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up the R-Car M3-N AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: Magnus Damm <damm@opensource.se>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The "official" Condor boards have always been wired to mount NFS via
GEther, not EtherAVB -- the boards resoldered for EtherAVB were local
to Cogent Embedded, so we've been having an unpleasant situation where
a "normal" Condor board still can't mount NFS (unless an EtherAVB PHY
extension board is plugged in). Switch from EtherAVB to GEther at last!
Fixes: 8091788f3d ("arm64: dts: renesas: condor: add EtherAVB support")
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
hscif2 has 4 dmas, but has only 2 dma-names.
This patch add missing dma-names.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Fixes: e0f0bda793 ("arm64: dts: renesas: r8a7795: sort subnodes
of the soc node")
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to
the R8A77990 SoC.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe MSIOF in the R8A779{7|8}0 device trees.
The DMA props are omitted for R8A77980 as the RT-DMAC isn't supported
(yet?)...
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The M3-N (r8a77965) platform has one LVDS encoder connected to the DU.
Add the corresponding DT node and wire it up.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe THS/CIVM in the R8A77980 device trees.
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe THS/CIVM in the R8A77970 device tree.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Describe PWMs in the R8A779{7|8}0 device trees.
Based on the original (and large) patches by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds a device node for the Interrupt Controller for External
Devices (INTC-EX) on R-Car E3, which serves external IRQ pins IRQ[0-5].
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
commit 2d87dc0e5b ("arm64: dts: renesas: r8a7795: Add address
properties to rcar_sound port nodes") added missing #address-cells
and #size-cells for sound ports.
But, these are based on platform, not on SoC. This patch cleanups it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for both RZ/G2M CAN channels.
Signed-off-by: Chris Paterson <chris.paterson2@renesas.com>
Reviewed-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Based on a similar patch of the R8A7796 device tree
by Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
