Commit Graph

5 Commits

Author SHA1 Message Date
Thomas Gleixner
9c92ab6191 treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 282
Based on 1 normalized pattern(s):

  this software is licensed under the terms of the gnu general public
  license version 2 as published by the free software foundation and
  may be copied distributed and modified under those terms this
  program is distributed in the hope that it will be useful but
  without any warranty without even the implied warranty of
  merchantability or fitness for a particular purpose see the gnu
  general public license for more details

extracted by the scancode license scanner the SPDX license identifier

  GPL-2.0-only

has been chosen to replace the boilerplate/reference in 285 file(s).

Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.642774971@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-06-05 17:36:37 +02:00
Bartlomiej Zolnierkiewicz
9bebf3485c thermal: ti-soc-thermal: remove dead code
Majority of this code (i.e. functions from ti-bandgap.c) has been
introduced in May 2013 by commit eb982001db ("thermal: introduce TI
SoC thermal driver"). Just remove it altogether (in case it is needed
it can be easily resurrected from git repo).

While at it fix incorrect "not used" comments.

Tested-by: Keerthy <j-keerthy@ti.com>
Acked-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-07-27 14:43:01 -07:00
Keerthy
004f772871 thermal: ti-soc-thermal: Remove redundant constants
Now that slope and offset data are being passed from
device tree no need to populate in driver data.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29 22:14:51 -07:00
Eduardo Valentin
b840b6e65c thermal: ti-soc-thermal: add OMAP36xx support
Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf

Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-29 14:13:19 -07:00
Pavel Machek
9c5c87e593 ti-soc-thermal: implement omap3 support
This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-29 14:08:24 -07:00