Pull thermal management updates from Zhang Rui:
- Fix a problem where orderly_shutdown() is called for multiple times
due to multiple critical overheating events raised in a short period
by platform thermal driver. (Keerthy)
- Introduce a backup thermal shutdown mechanism, which invokes
kernel_power_off()/emergency_restart() directly, after
orderly_shutdown() being issued for certain amount of time(specified
via Kconfig). This is useful in certain conditions that userspace may
be unable to power off the system in a clean manner and leaves the
system in a critical state, like in the middle of driver probing
phase. (Keerthy)
- Introduce a new interface in thermal devfreq_cooling code so that the
driver can provide more precise data regarding actual power to the
thermal governor every time the power budget is calculated. (Lukasz
Luba)
- Introduce BCM 2835 soc thermal driver and northstar thermal driver,
within a new sub-folder. (Rafał Miłecki)
- Introduce DA9062/61 thermal driver. (Steve Twiss)
- Remove non-DT booting on TI-SoC driver. Also add support to fetching
coefficients from DT. (Keerthy)
- Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)
- Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
Brian Bian)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: core: Add a back up thermal shutdown mechanism
thermal: core: Allow orderly_poweroff to be called only once
Thermal: Intel SoC DTS: Change interrupt request behavior
trace: thermal: add another parameter 'power' to the tracing function
thermal: devfreq_cooling: add new interface for direct power read
thermal: devfreq_cooling: refactor code and add get_voltage function
thermal: mt8173: minor mtk_thermal.c cleanups
thermal: bcm2835: move to the broadcom subdirectory
thermal: broadcom: ns: specify myself as MODULE_AUTHOR
thermal: da9062/61: Thermal junction temperature monitoring driver
Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
thermal: broadcom: add Northstar thermal driver
dt-bindings: thermal: add support for Broadcom's Northstar thermal
thermal: bcm2835: add thermal driver for bcm2835 SoC
dt-bindings: Add thermal zone to bcm2835-thermal example
thermal: rcar_gen3_thermal: add suspend and resume support
thermal: rcar_gen3_thermal: store device match data in private structure
thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
thermal: rcar_gen3_thermal: record and check number of TSCs found
thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
...
orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).
However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.
Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.
Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.
Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.
(*) It looks like the configuration was never tested with
INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.
If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.
The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).
This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.
When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.
This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add basic thermal driver for bcm2835 SoC.
This driver currently make sure that tsense HW block is set up
correctly.
Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.
The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.
Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal driver is standalone driver which is used to enable
thermal sensors, so it can be used with any cooling device and
should not bind with CPU cooling device driver.
This original patch is suggested by Amit Kucheria; so it's to
polish the dependency in Kconfig, and remove the dependency with
CPU_THERMAL.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.
v2: drop extraneous OF
Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.
It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.
Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.
Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.
Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
INT3406 ACPI device object resembles an ACPI video output device, but its
_BCM is said to be deprecated and should not be used. So we will make
use of the raw interface to do the actual cooling.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
At least with CONFIG_COMPILE_TEST, there's no reason to assume
that CONFIG_RESET_CONTROLLER is set, but the code for this
controller requires it since it calls device_reset().
Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER.
Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'
The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Make use of ARCH_RENESAS in place of ARCH_SHMOBILE.
This is part of an ongoing process to migrate from ARCH_SHMOBILE to
ARCH_RENESAS the motivation for which being that RENESAS seems to be a more
appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs.
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This driver only has runtime but no build time dependencies, so it can be
built for testing purposes if the Kconfig COMPILE_TEST option is enabled.
This is useful to have more build coverage and make sure that drivers are
not affected by changes that could cause build regressions.
Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the thermal subsystem is a loadable module, the u8500 driver
fails to build:
drivers/thermal/built-in.o: In function `db8500_thermal_probe':
db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
drivers/thermal/built-in.o: In function `db8500_thermal_work':
db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'
This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
When the thermal subsystem is a loadable module, the spear driver
fails to build:
drivers/thermal/built-in.o: In function `spear_thermal_exit':
spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
drivers/thermal/built-in.o: In function `spear_thermal_probe':
spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'
This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This just caused build errors:
warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'
While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.
Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d342 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.
The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
After the commit "thermal: core: Add Kconfig option to enable writable
trips", by default the trips are read only. This cause user space thermal
controllers to poll for temperature as they can't set temperature
thresholds for getting a notification via uevents. These programs use RW
trip in a zone to register thresholds. Since we need to enable the new
config introduced by above commit to allow writable trips, selecting
CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.
Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
