All tool/utility signons.
Dual-license module header.
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Lv Zheng <lv.zheng@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
ACPICA commit dfa394471f6c01b2ee9433dbc143ec70cb9bca72
Mostly indentation inconsistencies across the code. Split
some long lines, etc.
Link: https://github.com/acpica/acpica/commit/dfa39447
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Lv Zheng <lv.zheng@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
ACPICA commit 8990e73ab2aa15d6a0068b860ab54feff25bee36
Link: https://github.com/acpica/acpica/commit/8990e73a
Signed-off-by: David E. Box <david.e.box@linux.intel.com>
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Lv Zheng <lv.zheng@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Update ACPICA copyrights to 2014. Includes all source headers and
signons for the various tools.
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Lv Zheng <lv.zheng@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Improves configurability of ACPICA.
Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Lv Zheng <lv.zheng@intel.com>
Acked-by: Len Brown <len.brown@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
