The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The TSENS controller in 8996 family of SoCs is capable of converting the
ADC code outputs to real temperature values (in decidegree Celsius).
It can also be programmed to provide raw ADC code, but the secure software
on 8996 programs it to provide real temperatures and also does the needed
calibrations.
We check the valid bit to ensure valid data is read by the AHB master.
And the spec recommends the below algorithm to read data 3 consecutive
times, which takes care of the worst case delay taken to propagate the
updated data to the register.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
8960 family of SoCs have the TSENS device as part of GCC, hence
the driver probes the virtual child device created by GCC and
uses the parent to extract all DT properties and reuses the GCC
regmap.
Also GCC/TSENS are part of a domain thats not always ON.
Hence add .suspend and .resume hooks to save and restore some of
the inited register context.
Also 8960 family have some of the TSENS init sequence thats
required to be done by the HLOS driver (some later versions of TSENS
do not export these registers to non-secure world, and hence need
these initializations to be done by secure bootloaders)
8660 from the same family has just one sensor and hence some register
offset/layout differences which need special handling in the driver.
Based on the original code from Siddartha Mohanadoss, Stephen Boyd and
Narendran Rajan.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add .calibrate support for 8974 family as part of tsens_ops.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add support to calibrate sensors on 8916 family and also add common
functions to read temperature from sensors (This can be reused on
other SoCs having similar TSENS device)
The calibration data is read from eeprom using the generic nvmem
framework apis.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
