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usb: dwc3: add glue layer dependencies

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Glue layers for the DWC3 driver only make sense on specific platforms.
Add dependencies so that they are not built where they aren't needed.

Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: WingMan Kwok <w-kwok2@ti.com>
Signed-off-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Felipe Balbi <balbi@ti.com>
This commit is contained in:
Jean Delvare 2014-04-08 10:42:40 +02:00 committed by Felipe Balbi
parent 1d57de306e
commit aea8928aba
1 changed files with 3 additions and 1 deletions
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4
drivers/usb/dwc3/Kconfig
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@ -44,7 +44,7 @@ comment "Platform Glue Driver Support"
config USB_DWC3_OMAP
tristate "Texas Instruments OMAP5 and similar Platforms"
depends on EXTCON
depends on EXTCON && (ARCH_OMAP2PLUS || COMPILE_TEST)
default USB_DWC3
help
Some platforms from Texas Instruments like OMAP5, DRA7xxx and
@ -54,6 +54,7 @@ config USB_DWC3_OMAP
config USB_DWC3_EXYNOS
tristate "Samsung Exynos Platform"
depends on ARCH_EXYNOS || COMPILE_TEST
default USB_DWC3
help
Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside,
@ -72,6 +73,7 @@ config USB_DWC3_PCI
config USB_DWC3_KEYSTONE
tristate "Texas Instruments Keystone2 Platforms"
depends on ARCH_KEYSTONE || COMPILE_TEST
default USB_DWC3
help
Support of USB2/3 functionality in TI Keystone2 platforms.