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linux_dsm_epyc7002/drivers/thermal/Makefile

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the generic thermal sysfs driver The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
2008-01-17 14:51:08 +07:00
#
# Makefile for sensor chip drivers.
#
thermal: add the support for building the generic thermal as a module Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-21 15:07:13 +07:00
obj-$(CONFIG_THERMAL) += thermal_sys.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 15:07:46 +07:00
# governors
obj-$(CONFIG_FAIR_SHARE) += fair_share.o
obj-$(CONFIG_STEP_WISE) += step_wise.o
obj-$(CONFIG_USER_SPACE) += user_space.o
# cpufreq cooling
obj-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
# platform thermal drivers
obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
thermal: add Renesas R-Car thermal sensor support This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-07-21 07:53:48 +07:00
obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
drivers/thermal/Makefile refactor Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 15:07:46 +07:00
obj-$(CONFIG_EXYNOS_THERMAL) += exynos_thermal.o
Thermal: Add ST-Ericsson DB8500 thermal driver. This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 17:56:42 +07:00
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
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